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PDF LFB212G45CG7D227 Data sheet ( Hoja de datos )

Número de pieza LFB212G45CG7D227
Descripción Chip Multilayer LC Filters
Fabricantes MuRata 
Logotipo MuRata Logotipo



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LFB212G45CG7D227 pdf
P4 /15
Spec No. JEMFGB-1357H
7. OTHER SPECIFICATION AND METHODS
No. Items
Specifications
1 Vibration
Appearance No severe damages
Resistance
Electrical
Satisfy specifications listed in
Specifications paragraph 6 over operational
temperature range
Test Methods
Solder specimens on the testing jig (glass
fluorine boards) shown in appended Fig.1 by
a solder. The soldering shall be done either
by iron or reflow and be conducted with care
so that the soldering is uniform and free of
defect such as by heat shock.
Frequency : 10~2000~10 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period
: 2 h on each direction
Total 6 h.
2 Shock
Appearance No severe damages
Solder specimens on the testing jig (glass
Electrical
Specifications
Satisfy specifications listed in
paragraph 6 over operational
temperature range
fluorine boards) shown in appended Fig.1 by
a solder. The soldering shall be done either
by iron or reflow and be conducted with care
so that the soldering is uniform and free of
defect such as by heat shock.
Acceleration : 980 m/s2
Period
: 6 ms.
Cycle
: 10 times
3 Deflection
No damage with 2mm deflection Solder specimens on the testing jig (glass
epoxy boards) shown in appended Fig.2 by
a solder. The soldering shall be done either
by iron or reflow and be conducted with care
so that the soldering is uniform and free of
defect such as by heat shock.
4 Soldering strength
(Push Strength)
9.8 N Minimum
Solder specimens onto test jig shown below.
Apply pushing force at 0.5mm/s until
electrode pads are pealed off or ceramics
are broken. Pushing force is applied to
longitudinal direction.
Pushing Direction
Specimen
Jig
5 Solderability of Termination 75% of the terminations is to be Immerse specimens first a ethanol
soldered evenly and continuously. (JIS-K-8101) solution of rosin (JIS-K-5902)
(25% rosin in weight proportion), then in a
solder solution for 2±0.5 s at 230±5 °C.
Preheat
: 100 ~ 120 °C60 s
Solder Paste : Sn-Ag-Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
MURATA MFG. CO., LTD.

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LFB212G45CG7D227 arduino
P10/15
Spec No. JEMFGB-1357H
(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
(6) The cover tape and base tape are not adhered at no components area for 250 mm min.
(7) Tear off strength against pulling of cover tape : 5 N min.
(8) Packaging unit : 4000 pcs. / reel
(9) Material : Base tape ......Plastic
Reel
......Plastic
(10) Peeling of force : 0.7 N max. in the direction of peeling as shown below.
0.7 N max.
165 to 180 °
Cover tape
Base tape
MURATA MFG. CO., LTD.

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