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PDF GP2W0106YP Data sheet ( Hoja de datos )
| Número de pieza | GP2W0106YP | |
| Descripción | 115 kbps Transceiver | |
| Fabricantes | Sharp Electrionic Components | |
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IrDA Data Sheet
GP2W0106YP
115 kbps Transceiver
FEATURES
• Built-in Photodiode
• Operating voltage 2.0 V to 3.6 V
• Conforms to eye safety IEC60825-1, without exter-
nal resistor
• This product shall not contain the following materi-
als, and these materials shall not be used in the pro-
duction process for this product.
– CFCS
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOS and PBBS are not used in this device.
INTRODUCTION
This specification applies to the outline and charac-
teristics of IrDA 1.2 type (data rate 2.4 kbps to
115.2 kbps, low power option compliant) optical data
communication transceiver.
NOTES
• Caution should be taken to prevent the detector sur-
face from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immedi-
ate or potential defects.
– Cleaning solvent: The cleaning shall be carried
out with ethyl alcohol, methyl alcohol, or isopropyl
alcohol.
• In order to prevent electrostatic damage to the inte-
grated circuit, handle this device in a static-free envi-
ronment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
designed by considering 200 µs or more that is spec-
ified by IrDA. This turn around time means the time
that this device does not temporarily detect the
incoming signal, since the transmitted light from the
transmitter side reaches the detector side of the
same transceiver.
• Consider that 200 µs or more (at TA = 25°C, no input
signal) is necessary to return from shut-down mode
to ready-operation mode. In addition, thoroughly
confirm the operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than desired signal output may
be generated as noise on output terminal of the
transceiver. Consider the layout and structure in
your design to minimize disturbing light on the
detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physi-
cal Layer Link Specification’ published by the Infra-
red Data Association. Faulty operation may occur, if
a signal method other than that specified is used.
• RXD pinout is a pullup (260 kΩ TYP.) to VDD in shut-
down mode. See Table 1 and Figure 2.
• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from
long-term continuous operation (50% degradation/5
years). The light emitting diode output may be
degraded quickly when operated at TA = -40°C, there-
fore it is recommended to operate over TA = -20°C.
IrDA Data Sheet
1
1 page  
115 kbps Transceiver
1.15
3.9 1.15 0.9
GP2W0106YP
2.5
7.9 ±0.3
5.2
φ2.2 φ2.2
CENTER EMBOSSED
CENTER
OF DETECTOR
'S'
OF EMITTER
2 ±0.3
0.8
+0.3
-0.2
0.35
1
2 345 67
8
8
-
0.4
+0.2
-0.3
PO .95 x 7 = 6.65
PIN PIN NAME SYMBOL
1 NC
2 NC
3 VDD
4 Ground
5 Shutdown
6 Receiver Data Output
7 Transmitter Data Input
8 LED Anode
NC
NC
VDD
GND
SD
RXD
TXD
LEDA
BOTTOM VIEW
8 - 0.6
PO .95 x 7 = 6.65
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.2
3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm.
area: Au plating
Figure 8. GP2W0106YP Outline Dimensions
0.6 ±0.3
GP2W0106YP-8
IrDA Data Sheet
5
5 Page 
115 kbps Transceiver
GP2W0106YP
OUTGOING INSPECTION
• Inspection lot: Inspection shall be carried out per
each delivery lot.
• Inspection method: A single sampling plan, normal
inspection level two based on ISO 2859 shall be
adopted.
Table 2. Outgoing Inspection
PARAMETER
INSPECTION ITEMS AND
TEST METHOD
Disconnection, short
Major defect
Inverse polarity on terminal
Soldering defect (obstacle to
use)
Electrical characteristic defect
Minor defect
Appearance defect which
affects the electrical character-
istics such as, split, chip,
scratch, stain, or blur
AQL(%)
0.1
0.1
0.1
0.1
0.25
PRECAUTIONS FOR SOLDERING
Solder Reflow
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 16.
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. Keep the
package temperature within that specified in Figure 16.
Also avoid immersing the resin part in the solder. Even if
within the temperature profile shown in Figure 16, there
is the possibility that the gold wire in the package may
break if the deformation of the PCB affects the lead pins.
Use after fully confirming the conditions of actual solder
reflow machine.
Soldering
• Soldering iron shall be less than 25 W, and temper-
ature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 5 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
230°C
MAX.
200°C
165°C
MAX.
1 - 4°C/s
1 - 4°C/s
1 - 4°C/s
25°C
IrDA Data Sheet
120 s MAX.
5 s MAX.
60 s MAX.
90 s MAX.
Figure 16. Temperature Profile
GP2W0106YP-16
11
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