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PDF BL2012-10B5512 Data sheet ( Hoja de datos )
| Número de pieza | BL2012-10B5512 | |
| Descripción | Multilayer Chip Baluns | |
| Fabricantes | Advanced Ceramic X | |
| Logotipo |  |
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BL 2012 Series
Multilayer Chip Baluns
ACX
Advanced Ceramic X
Features
Monolithic SMD with small, low-profile and
light-weight type.
Applications
0.8 ~ 6 GHz wireless communication systems,
including DECT/PACS/PHS/GSM/DCS phones,
WLAN card, Bluetooth modules, Hyper-LAN,
etc.
Specifications
Frequency Unbalanced Balanced Insertion
Part Number Range Impedance Impedance Loss
(MHz)
(ohm)
(ohm)
(dB)
VSWR
@BW
Phase Amplitude
Difference Difference
(degree)
(dB)
BL2012-
10B5512_
5150 ~
5875
50
100 1.0 max. 2.0 max. 180 ± 10 2 max.
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Power Capacity
: 4000
: -40 ~ +85 oC
: -40 ~ +85 oC
: 3W max.
Part Number
BL 2012 - 10 B
c d ef
5512
gh
/LF
i
c Type
BL : Balun
d Dimensions ( L × W ) 2.0 × 1.25 mm
e Balanced Impedance 10 : 100 ohm
f Specification Code B
g Central Frequency
i Soldering
5512 : 5512MHz h Packaging
lead-containing
/LF=lead-free
T: Tape & Reel
B: Bulk
Terminal Configuration
edc
fgh
No. Terminal Name No.
c
Unbalanced Port
(IN)
f
d GND or DC feed g
e
Balanced Port
(OUT1)
h
Terminal Name
Balanced Port
(OUT2)
GND
NC
1 page  
Soldering Conditions
Typical Soldering Profile for Lead-free Process
Flow Soldering :
Reflow Soldering :
260C
230oC
180oC
5s, max.
250oC
230oC
180oC
ACX
Advanced Ceramic X
10s, max.
Pre-heating
60s, min.
20s.
Time (s.)
Pre-heating
60s, min.
Time (s.)
30s.
Notes
The contents of this data sheet are subject to change without notice. Please confirm the specifications and
delivery conditions when placing your order.
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet BL2012-10B5512.PDF ] | |
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