DataSheet.es    


PDF AYF425035 Data sheet ( Hoja de datos )

Número de pieza AYF425035
Descripción FPC connectors
Fabricantes Panasonic 
Logotipo Panasonic Logotipo



Hay una vista previa y un enlace de descarga de AYF425035 (archivo pdf) en la parte inferior de esta página.


Total 8 Páginas

No Preview Available ! AYF425035 Hoja de datos, Descripción, Manual

For FPC
FPC connectors
(0.4mm pitch)
Back lock
Y4BH Series
New
RoHS compliant
FEATURES
1. Differential impedance matching
(100, 90, 85 Ω) compliant with various
high-speed transmission standards
FPC connector for high-speed
transmission
By matching the differential impedance,
this FPC connector offers excellent high-
speed differential transmission
characteristics and supports all high-
speed transmission standards
(when pin assignments are GSSG).
120
110
100
90
80
70
60
100
Connector
FPC
Tr = 40ps (20-80%)
200 300 400 500 600
Time, ps
2. Mechanical design freedom is
achieved with 0.4 mm pitch, 1.0 mm
height and double top and bottom
contacts
More freedom in mechanical design
With top and bottom contact construction
and no pin assignments, this FPC
connector contributes to customer design
freedom. (All pins can be used except
those for differential signals.)
1.00
3.20
Unit: mm
3. Easy-to-handle back lock structure
4. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
APPLICATIONS
Compact electronic devices such as
PCs, tablet PCs, digital still cameras
and digital video cameras.
ORDERING INFORMATION
AYF
41: 0.4 mm pitch (Back lock)
100Ω matched Differential impedance
42: 0.4 mm pitch (Back lock)
85Ω and 90Ω matched Differential impedance
Number of pins (2 digits)
Contact direction
3: Top and bottom double contacts
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
35
–1–
ACCTB67E 201410-T

1 page




AYF425035 pdf
Notes on Using FPC Connectors
Notes on Using FPC Connectors
PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
• In order to facilitate the connector mount, make sure to design
the board with reduced warpage.
• Please design and pay attention to the distance from the board
edge to the pattern. When cutting the board, do not give an
excessive stress to the connector, which risks damaging the
connector.
(Y3BW/Y5BW)
• Depending on FPC dimension and FPC insertion location,
there is a possibility that the holding contact and an FPC pattern
of both end of signal contacts are in short-circuited.
Please design the equipment not to be affected even if a board
pattern of holding contacts and an FPC pattern of both end of
signal contacts are in short-circuited.
(For example: Do not connect a board pattern of holding
contacts and GND.
If connect a board pattern of holding contacts and GND, also
connect board pattern of both end of signal contacts.)
FPC and equipment design
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
• Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC removed and connector deformation may occur by a
fall, vibration, or other impact. Carefully check the equipment
design and take required measures to prevent the FPC
removed.
If the shock of falling, vibration is applied to the FPC, please
design the equipment not to be applied a load to connector, such
as fixing the FPC.
• Make sure to design the FPC insertion part with reduced
warpage. Otherwise, the warpage may adversely affect the FPC
insertion.
(Y4BH)
When using in high-speed transmission applications,
please take care when designing the FPC, because the
differential impedance values may be uneven depending on
FPC dimensions settings, uneven dimensions, and layering
composition.
(Y3BW/Y5BW)
The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the
connector, and the shape of the soldered portions is the
same as that of the signal contacts.
Use caution to ensure connect identification.
(Y3BL)
Soldering terminal structure
Since soldering terminals touch FPC, note that the short
circuit may occur when the metal parts exposed on side of
FPC.
• Depending on FPC dimension, there is a possibility that
soldering terminals and an FPC pattern of both end of signal
contacts are in short-circuited.
Please design the equipment not to be affected even if a
board pattern of soldering terminals and an FPC pattern of
both end of signal contacts are in short-circuited.
(For example: Do not connect a board pattern of soldering
terminals and GND. If connect a board pattern of soldering
terminals and GND, also connect board pattern of both end of
signal contacts.)
Connector mounting
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
Soldering
1) Manual soldering
• Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and flux wicking near the contact points, or solder interfer-
ence may cause impact contact.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120μm is recommended during cream
solder printing.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature profile is given in the
figure below.
Temperature
260°C
230°C
180°C
150°C
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Peak temperature
Preheating
60 to 120 sec.
220°C
200°C
25 sec.
70 sec.
Time
–5–
ACCTB13E 201410-T

5 Page










PáginasTotal 8 Páginas
PDF Descargar[ Datasheet AYF425035.PDF ]




Hoja de datos destacado

Número de piezaDescripciónFabricantes
AYF425035FPC connectorsPanasonic
Panasonic

Número de piezaDescripciónFabricantes
SLA6805M

High Voltage 3 phase Motor Driver IC.

Sanken
Sanken
SDC1742

12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters.

Analog Devices
Analog Devices


DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares,
permitiéndote verlos en linea o descargarlos en PDF.


DataSheet.es    |   2020   |  Privacy Policy  |  Contacto  |  Buscar