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PDF ACPM-7311 Data sheet ( Hoja de datos )

Número de pieza ACPM-7311
Descripción UMTS800 4x4 Power Amplifier Module
Fabricantes AVAGO 
Logotipo AVAGO Logotipo



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No Preview Available ! ACPM-7311 Hoja de datos, Descripción, Manual

ACPM-7311
UMTS800 4x4 Power Amplifier Module
(824-849MHz)
Data Sheet
Description
The ACPM-7311, a Wide-band
Code Division Multiple
Access(WCDMA) Power Amplifier
(PA), is a fully matched 10-pin
surface mount module developed
for WCDMA handset applications.
This power amplifier module
operates in the 824-849MHz
bandwidth. The ACPM-7311
meets the stringent WCDMA
linearity requirements for output
power of up to 28dBm.
The ACPM-7311 is also
developed to meets HSDPA
specs. Mode Control pins are
provided for high efficiency
improvement of the low output
power range.
The ACPM-7311 is self contained,
incorporating 50ohm input and
output matching networks.
Functional Block Diagram
Ven (1)
Vmode0 (2) Vmode1 (3)
Vcc1 (5)
MMIC
Bias Circuit & Control Logic
MODULE
Features
• Excellent linearity
• Low quiescent current
• High Efficiency
42% at Pout=28dBm
18% at Pout=16dBm
5.5% at Pout=8dBm
(without DCDC Converter)
• 10-pin surface mounting package
(4 mm x 4 mm x 1.1 mm)
• Internal 50 ohm matching networks
for both RF input & output
Applications
• WCDMA handset (HSDPA)
RF Input
(4)
Input
Match
DA
Inter
Stage
Match
PA
Output
Match
RF Output
(8)
Vcc2 (6)
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Avago Technologies releases this product for general
sales, Avago Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the product(s) at
anytime.
ACPM-7311
Revision Date: May 30, 2006
Revision Number: DS 0.08
Preliminary Data Sheet

1 page




ACPM-7311 pdf
Evaluation Board Description
Ven
Vmode0
Vmode1
RF In
Vcc1
C5
2.2`uF
C1
100pF
C2
100pF
C3
100pF
1 Ven
2 Vmode0
3 Vmode1
4 RF In
C4
100pF
5 Vcc1
GND 10
GND 9
RF Out 8
GND 7
Vcc2 6
RF Out
C6
220pF
Vcc2
C7
2.2uF
Figure 1. Evaluation Board Schematic
C3 C2 C1
AVAGO
ACPM-7311
PYYWW
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C4 C6
C5 C7
Figure 2. Evaluation Board Assembly Diagram

5 Page





ACPM-7311 arduino
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs
naturally in the environment.
With the increase in voltage
potential, the outlet of neutraliza-
tion or discharge will be sought.
If the acquired discharge route is
through a semiconductor device,
destructive damage will result.
ESD countermeasure methods
should be developed and used to
control potential ESD damage
during handling in a factory
environment at each manufactur-
ing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface
mount package is sensitive to
damage induced by absorbed
moisture and temperature.
Avago Technologies follows
JEDEC Standard J-STD 020B.
Each component and package
type is classified for moisture
sensitivity by soaking a known
dry package at various temperatures
and relative humidity, and times.
After soak, the components are
subjected to three consecutive
simulated reflows.
The out of bag exposure time
maximum limits are determined
by the classification test
describe below which corre-
sponds to a MSL classification
level 6 to 1 according to the
JEDEC standard IPC/JEDEC
J-STD-020B and J-STD-033.
ACPM-7311 is MSL3. Thus,
according to the J-STD-033
p.11 the maximum Manufacturers
Exposure Time (MET) for this part
is 168 hours. After this time period,
the part would need to be
removed from the reel, de-taped
and then re-baked.
MSL classification reflow
temperature for the ACPM-7311
is targeted at 260+0/-5. Figure
10 and Table 8 show typical SMT
profile for maximum tempera-
ture of 260 +0/-5.
Table 6. ESD Classification
Pin #
Name
Description
1 Ven Supply Voltage
2
Vmode0
RF Input
3
Vmode1
Ground
4
RF In
Control Voltage
5 Vcc1 Enable Voltage
6 Vcc2 Ground
7 GND Ground
8
RF Out
RF Output
9 GND Ground
10 GND Supply Voltage
Note :
1. Module products should be considered extremely ESD sensitive
Table 7. Moisture Classification Level and Floor Life
HBM
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
± 2000V
CDM
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
± 200V
Classification
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
MSL Level
Floor Life (out of bag) at factory ambient =< 30oC/60% RH or as stated
1 Unlimited at =< 30oC/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.

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