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PDF 42SL90QD-AA Data sheet ( Hoja de datos )
| Número de pieza | 42SL90QD-AA | |
| Descripción | LED LCD TV SERVICE MANUAL | |
| Fabricantes | LG | |
| Logotipo |  |
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Internal Use Only
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LED LCD TV
SERVICE MANUAL
CHASSIS : LB91L
MODEL : 42SL90QD 42SL90QD-AA
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL60020331 (0909-REV00)
Printed in Korea
1 page  
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
-5-
LGE Internal Use Only
5 Page 
4. Total Assembly line process
4-1. Adjustment Preparation
• W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
• Above 5 minutes H/run in the inner pattern. (Power on” key
of adjust remote control)
Minute
Cool
Medium
Warm
1
0~4
276/289
293/308
318/338
2
5~9
276/288
293/307
319/337
3
10~14
275/286
292/305
318/335
4
15~24
274/284
291/303
317/333
5
25~39
273/282
290/301
316/331
6
40~49
272/280
289/298
315/329
7
50~79
270/277
287/295
314/326
8
80~
269/273
285/293
312/324
- Connecting picture of the measuring instrument
(On Automatic control)
Inside PATTERN is used when W/B is controlled. Connect to
auto controller or push Adjustment R/C POWER-ON ->
Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight
around is blocked. (illumination is less than 10ux).
2) Adhere closely the Color Analyzer (CA210) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 15 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check
the back light on.
* Auto adjustment Map(RS-232C)
- RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
RS-232C COMMAND
MIN
[CMD ID DATA]
CENTER
(DEFAULT)
MAX
Cool Mid Warm
Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 255
G Gain jh Jb je 00 172 192 192 255
B Gain ji Jc jf 00 192 192 172 255
R Cut
64 64 64 128
G Cut
64 64 64 128
B Cut
64 64 64 128
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “G” key at “3. White
Balance”.
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Country Group
5. ADC Calibration
6. White Balance
7. Test Pattern
8. EDID D/L
9. Sub B/C
10. V-Com
11. P-Gamma
White Balance
Color Temp.
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern.
Reset
Cool
172
172
192
64
64
64
ON
To set
* After done all adjustments, Press “In-start” button and compare
Tool option and Area option value with its BOM, if it is correctly
same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug AC
cable.
For correct it to the model’s module from factory JIG model.
* Push the “IN STOP KEY” after completing the function inspection.
4-2. DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-Sub Jack.
• Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4-3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
• Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
4-4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***: Year : Controlled
****: Check sum
** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 11 -
LGE Internal Use Only
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet 42SL90QD-AA.PDF ] | |
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