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PDF AX1250S Data sheet ( Hoja de datos )
| Número de pieza | AX1250S | |
| Descripción | 1.5A Sink/Source Bus Termination Regulator | |
| Fabricantes | AXElite | |
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AX1250S
1.5A Sink/Source Bus Termination Regulator
GENERAL DESCRIPTION
AX1250S is a linear regulator designed as a cost-effective solution for active
termination of DDR SDRAM. The converting voltage range is from 1.3V to 5.5V into a
desired output voltage, which is adjusted by two external resistors. The current sourcing
and sinking capability of the regulator is up to 1.5A while the output voltage within 2%.
This device provides on-chip thermal shutdown and current limit functions for circuit
tolerance of the output fault conditions. SOP-8L package is available for all commercial
and industrial surface mount applications.
FEATURES
- Ideal for DDR-I, DDR-II and DDR-III applications
- Capable of sourcing and sinking current 1.5A
- Integrated power MOSFETs
- Current limiting protection
- Thermal shutdown protection
- High accuracy output voltage at full load
- Output Voltage Traces REFEN Pin Voltage
- Low external component count
- Shutdown for standby or suspend mode operation with high-Impedance output
- SOP-8L Pb-Free Package.
1/9
Axelite Confidential Materials, do not copy or distribute without written consent.
Rev.1.5 Aug.24, 2011
1 page  
AX1250S
Thermal Considerations
The AX1250S series can deliver a current of up to 1.5A over the full operating
junction temperature range. However, the maximum output current must be dated at higher
ambient temperature to ensure the junction temperature does not exceed 125°C. With all
possible conditions, the junction temperature must be within the range specified under
operating conditions. Power dissipation can be calculated based on the output current and
the voltage drop across regulator.
PD = (VIN - VOUT) × IOUT+ VIN × IQ
The final operating junction temperature for any set of conditions can be estimated by
the following thermal equation:
PD (MAX) = (TJ (MAX) - TA) / θJA
Where TJ (MAX) is the maximum junction temperature of the die (125°C) and TA is the
maximum ambient temperature. The junction to ambient thermal resistance (θJA) for
SOP-8L package at recommended minimum footprint is 60°C/W on 1.5 in2 and Multi-layer
PCB layout. The maximum power dissipation at TA = 25°C can be calculated by following
formula:
PD (MAX) = (125°C - 25°C) / 60°C /W = 1.67W
The thermal resistance θJA of SOP-8L is determined by the package design and the
PCB design. However, the package design has been decided. If possible, it's useful to
increase thermal performance by the PCB design. The thermal resistance can be
decreased by adding wide copper to VCNTL pins. We have to consider the copper couldn't
stretch infinitely and avoid the tin overflow.
5/9
Axelite Confidential Materials, do not copy or distribute without written consent.
Rev.1.5 Aug.24, 2011
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet AX1250S.PDF ] | |
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