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Número de pieza | NDT01N60T1G | |
Descripción | N-Channel Power MOSFET / Transistor | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de NDT01N60T1G (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! NDD01N60, NDT01N60
N-Channel Power MOSFET
600 V, 8.5 W
Features
• 100% Avalanche Tested
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant
ABSOLUTE MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol NDD NDT Unit
Drain−to−Source Voltage
CStoenatdinyuSoutasteD, rTaCin=C2u5rr°eCnt(NRoqtJeC 1)
Continuous Drain Current
Steady State, TC = 100°C
R(NqoJCte
1)
Pulsed Drain Current, tp = 10 ms
PStoewaedryDSitsastiep,aTtiCon=–2R5°qCJC
Gate−to−Source Voltage
Single Pulse Drain−to−Source
Avalanche Energy (IPK = 1.0 A)
Peak Diode Recovery (Note 2)
VDSS
ID
ID
IDM
PD
VGS
EAS
dv/dt
600
1.5 0.4
V
A
1.0 0.25 A
6.0 1.5
A
46 2.5 W
±30 V
13 mJ
4.5 V/ns
Source Current (Body Diode)
Lead Temperature for Soldering
Leads
IS
1.5 0.4
A
TL 260 °C
Operating Junction and Storage
Temperature
TJ, TSTG −55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by maximum junction temperature
2. IS = 1.5 A, di/dt ≤ 100 A/ms, VDD ≤ BVDSS
THERMAL RESISTANCE
Parameter
Symbol Value Unit
Junction−to−Case (Drain)
NDD01N60
Junction−to−Ambient
(Note 4) NDD01N60
(Note 3) NDD01N60−1
(Note 4) NDT01N60
(Note 5) NDT01N60
RqJC
RqJA
2.7 °C/W
38 °C/W
96
58
141
3. Insertion mounted.
4. Surface−mounted on FR4 board using 1” sq. pad size
(Cu area = 1.127” sq. [2 oz] including traces).
5. Surface−mounted on FR4 board using minimum recommended pad size
(Cu area = 0.026” sq. [2 oz]).
© Semiconductor Components Industries, LLC, 2013
January, 2013 − Rev. 2
1
http://onsemi.com
V(BR)DSS
600 V
RDS(ON) MAX
8.5 W @ 10 V
N−Channel MOSFET
D (2)
G (1)
S (3)
12
3
MARKING
DIAGRAMS
4
Drain
4 DPAK
CASE 369C
STYLE 2
2
1 Drain 3
Gate Source
4
IPAK
CASE 369D
STYLE 2
4
Drain
1 23
Y = Year
WW = Work Week
G = Pb−Free Package
1 23
Gate Drain Source
1 23
A
Y
W
01N60
Drain
4 SOT−223
4
CASE 318E
STYLE 3
= Assembly Location
= Year
= Work Week
= Specific Device Code
AYW
01N60G
G
12 3
Gate Drain Source
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Publication Order Number:
NDD01N60/D
1 page NDD01N60, NDT01N60
TYPICAL CHARACTERISTICS
10
50% Duty Cycle
1 20%
10%
5%
2%
0.1
1%
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 13. Thermal Impedance (Junction−to−Case) for NDD01N60
100
50% Duty Cycle
20%
10 10%
5%
2%
1 1%
100 1000
0.1
Single Pulse
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10 100 1000
PULSE TIME (sec)
Figure 14. Thermal Impedance (Junction−to−Ambient) for NDT01N60
http://onsemi.com
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5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet NDT01N60T1G.PDF ] |
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NDT01N60T1G | N-Channel Power MOSFET / Transistor | ON Semiconductor |
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