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PDF AV-29BS26 Data sheet ( Hoja de datos )

Número de pieza AV-29BS26
Descripción FLAT COLOUR TELEVISION SERVICE MANUAL
Fabricantes JVC 
Logotipo JVC Logotipo



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No Preview Available ! AV-29BS26 Hoja de datos, Descripción, Manual

SERVICE MANUAL
FLAT COLOUR TELEVISION
Y210A04670 AV-29BS26,AV-29BS26/A,
AV-29BX16/G,AV-29BX16/L,
AV-29BX16/S
BASIC CHASSIS
CW3
RM-C1286
TABLE OF CONTENTS
1 PRECAUTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-33
COPYRIGHT © 2006 Victor Company of Japan, Limited
No.YA470
2006/10

1 page




AV-29BS26 pdf
2.3 TECHNINAL INFORMATION
2.3.1 MAIN MI-COM (CPU) PIN FUNCTION
Pin
No.
Pin name
1 VssP2
2 VssC4
3 V1.8C4
4 V3.3A3
5 VrefP_Sdac
6 VrefN_Sdac
7 VrefP_Sdac
8 VrefN_Sdac
9 VrefP_Sdac
10 XtalIn
11 XtalOut
12 VssA1
13 NECK
14 CONT
15 V5P1
16 Ph2
17 Ph1
18 Gnd1
19 SecPll
20 Dec8G
21 EW
22 VDRB-
23 VDRA+
24 Vif1
25 Vif2
26 Vsc
27 Iref
28 GndIF
29 Sif1
30 Sif2
31 AGC
32 EHT
33 Ssif/RefIn/Avl/
RefOut
34 L3
35 R3
36 L-OUT
37 R-OUT
38 DecsDem
39 QssO/AmO/
AudeEm
40 Gnd2
41 PllIf
42 SifAgc
43 IfVo/FmRo/DvbO
44 NC
45 V8AudioSwitches
46 AgcSsif
47 V5P2
48 V-OUT
49 L1
50 R1
51 V3
52 C4
53 Audio2InL
54 Audio2InR
55 V2/Y
56 L2
57 R2
58 Y3/Cvbs
59 C1
60 AudioLsL
61 AudioLsR
62 HP-L
63 HP-R
64 CVBSO/PIP
I/O
Function
Pin
No.
Pin name
- GND
65 SVM
- GND
66 FbiSo
I 1.8V (Digital)
67 Hout
I 3.3V
68 VssComb
I 3.3V (Positive)
69 V5Comb
- GND
70 Vin/R2/Pr
I 3.3V (Negative)
71 Uin/B2/Pb
- GND
72 Yin/G2/Y
I 3.3V (Positive)
73 Ysync
I 24.576MHz for system clock
74 Yout
O 24.576MHz for system clock
75 Uout/INSSW2
- GND
76 NC
I V-guard input/ I/O switch
77 INSSW3
I 1.8V regulator control
78 R3/Pr
I +5V
79 G3/Y
- Phase-2 filter
80 B3/Pb
- Phase-1 filter
81 Gnd3
- GND
82 V5P3
- SECAM PLL decoupling
83 BCL
- Bandgap decoupling
84 BLKIN
O East-West drive output
85 Rout
O Vertical drive B output
86 Gout
O Vertical drive A output
87 Bout
I Video IF input 1
88 V3.3A1
I Video IF input 2
89 RefAdN
- Vertical sawtooth capacitor
90 V3.3RefAdP
I Reference current input
91 RefAd
- GND
92 GndA
I Sound IF input 1
93 V1.8A
I Sound IF input 2
94 V3.3A2
O Tuner AGC output
95 VssADC
I EHT/overvoltage protection input
96 V1.8ADC
O Automatic Volume Levelling/ sound IF input / subcar- 97 REMOTE
rier reference output / external reference signal input
for I signalmixer for DVB operation
I Audio-L3 input (left signal)
98 PW_LED
I Audio-R3 input (right signal)
99 PW_LED
O Audio L output
100 V1.8C2
O Audio R output
101 VssC2
- Decoupling sound demodulator
102 TIMER
O QSS intercarrier output / AM output / deemphasis / 103 TIMER
(front-end audio out)
- GND
104 VER_PROTECT
- IF-PLL loop filter
105 S_REDUCE
- AGC sound IF
106 P00/I2SDI1
O Not used
107 POWER
O Not used
108 SCL1
I 8V
109 SDA1
- AGC capacitor second sound IF
110 V3.3P
I 5V
111 ROTATION
O Video output
112 3.58/OTHER
I Audio-L1 input
113 A_MUTE
I Audio-R1 input
114 4.5/OTHER
I Video V3 input
115 PROT
I Not used
116 ECO_IN
I Not used
117 V1.8C1
I Not used
118 DecV1V8
I Video V2 input
119 KEY_IN
I Audio L2 input (Left signal)
120 VDO-DET
I Audio R2 input (right signal)
121 VSSC1+P1
I S-Video Y1 input
122 S_V_DET
I S-Video C1 input
123 P25/PWM4
O Audio L output for audio power amplifier
124 V1.8C3
O Audio R output for audio power amplifier
125 VssC3
O Not used
126 P12/Int2
O Not used
127 SDA0
O CVBS / PIP output
128 SCL0
I/O Function
O Not used
I Flyback input/sandcastle output
O Horizontal output
- GND
I 5V
I PIP R input
I PIP B input
I PIP G input
I Not used
O Not used
I YUV insertion input
O Not used
I YUV insertion input
I Component PR input (Video-2)
I Component Y input (Video-2)
I Component PB input (Video-2)
- GND
I 5V
I Beam current limiter input
I Black current input
O R output
O G output
O B output
I 3.3V
- GND
I 3.3V (Positive)
I 3.3/2V
- GND
I 1.8V
I 3.3V
- GND
I 1.8V
I Remote control
I POWER LED control
I POWER LED control
I 1.8V
- GND
- Not used
- Not used
O X-ray protect
O Sound control
O Not used
O SUB POWER control
I I2C bus clock
I/O I2C bus data
I 3.3V
O Rotation
O NTSC 3.58 detection
O Audio muting
O NTSC 4.43 detection
I Protect
I ECO sensor level detection
I 1.8V (Digital)
I 1.8V
I Key scan data
I Video DET input
- Digital GND
I S-Video DET input
O GTVA_reset
I 1.8V (Digital)
- GND
I External interrupt
I/O I2C bus data (for memory)
I I2C bus clock (for memory)
(No.YA470)1-5

5 Page





AV-29BS26 arduino
3.3 REPLACEMENT OF CHIP COMPONENT
3.3.1 CAUTIONS
(1) Avoid heating for more than 3 seconds.
(2) Do not rub the electrodes and the resist parts of the pattern.
(3) When removing a chip part, melt the solder adequately.
(4) Do not reuse a chip part after removing it.
3.3.2 SOLDERING IRON
(1) Use a high insulation soldering iron with a thin pointed end of it.
(2) A 30w soldering iron is recommended for easily removing parts.
3.3.3 REPLACEMENT STEPS
1. How to remove Chip parts
2. How to install Chip parts
[Resistors, capacitors, etc.]
[Resistors, capacitors, etc.]
(1) As shown in the figure, push the part with tweezers and
alternately melt the solder at each end.
(1) Apply solder to the pattern as indicated in the figure.
(2) Shift with the tweezers and remove the chip part.
(2) Grasp the chip part with tweezers and place it on the
solder. Then heat and melt the solder at both ends of the
chip part.
[Transistors, diodes, variable resistors, etc.]
(1) Apply extra solder to each lead.
SOLDER
SOLDER
[Transistors, diodes, variable resistors, etc.]
(1) Apply solder to the pattern as indicated in the figure.
(2) Grasp the chip part with tweezers and place it on the
solder.
(3) First solder lead A as indicated in the figure.
(2) As shown in the figure, push the part with tweezers and
alternately melt the solder at each lead. Shift and remove
the chip part.
NOTE :
After removing the part, remove remaining solder from the
pattern.
A
C
B
(4) Then solder leads B and C.
A
C
B
(No.YA470)1-11

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