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PDF GBU406 Data sheet ( Hoja de datos )

Número de pieza GBU406
Descripción GLASS PASSIVATED BRIDGE RECTIFIER
Fabricantes KD 
Logotipo KD Logotipo



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No Preview Available ! GBU406 Hoja de datos, Descripción, Manual

GBU4005 THRU GBU410
GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 4.0 Ampere
FEATURES
Glass passivated chip junction
Reliable low cost construction utilizing molded
plastic technique
Ideal for printed circuit board
Low reverse leakage current
Low forward voltage drop
High surge current capabiliy
MECHANICAL DATA
Case:Molded plastic, GBU
Terminals: Terminals: Leads solderable per MIL-STD-202
method 208 guaranteed
Epoxy: UL 94V-0 rate flame retardant
Mounting Position: Any
.752(19.1)
.720(18.3)
.073(1.85)
.057(1.45)
GBU
.874(22.2)
.860(21.8)
3.2*3.2
CHAMFER
.139(3.53)
.133(3.37)
.154(3.9)
.146(3.7)
.232(5.9)
.224(5.7)
.720(18.29)
.680(17.27)
.050(1.27)
.040(1.02)
.100(2.54)
.085(2.16)
.106(2.7)
.080(2.03) .091(2.3)
.065(1.65)
.210 .210 .210
.190 .190 .190
(5.3) (5.3) (5.3)
(4.8) (4.8) (4.8)
.022(.56)
.018(.46)
Dimensions in inches and (milimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
Symbols
GBU
4005
GBU
401
GBU
402
GBU
404
GBU
406
GBU
408
GBU
410
Units
Maximum Recurrent Peak Reverse Voltage
VRRM
50 100 200 400 600 800 1000 V
Maximum RMS Voltage
VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
VDC 50 100 200 400 600 800 1000 V
Maximum Average Forward Rectified Current with
Heatsink at TC = 100 OC
I(AV)
4.0
2.4
A
Peak Forward Surge Current, 8.3 ms Single Half-Sine
-Wave superimposed on rated load (JEDEC Method)
IFSM
150
A
Maximum Forward Voltage at 2.0 A DC and 25 OC
VF
1.1
V
Maximum Reverse Current at TA = 25 OC
at Rated DC Blocking Voltage TA = 125 OC
IR
10.0
500
µA
Typical Junction Capacitance 1)
CJ 45 pF
Typical Thermal Resistance 2)
RθJC
2.2 OC/W
Operating and Storage Temperature Range
TJ,TS
-55 to +150
OC
1) Measured at 1 MHz and applied reverse voltage of 4 VDC.
2) Thermal resistance from junction to case with device mounted on 300 mm X 300 mm X 1.6 mm Cu plate
heatsink.

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