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PDF 298D226X06R3M2T Data sheet ( Hoja de datos )

Número de pieza 298D226X06R3M2T
Descripción Solid Tantalum Chip Capacitors
Fabricantes Vishay 
Logotipo Vishay Logotipo



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No Preview Available ! 298D226X06R3M2T Hoja de datos, Descripción, Manual

298D
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTANTM Leadframeless Molded
FEATURES
Small sizes include 0603 and 0402 footprint
Lead (Pb)-free L-shaped terminations
8 mm tape and reel packaging available per
EIA-481-1 and reeling per IEC 286-3
7" [178 mm] standard
Compliant to RoHS directive 2002/95/EC
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 85 °C
(to + 125 °C voltage derating)
Capacitance Range: 1 µF to 220 µF
Capacitance Tolerance: ± 20 % standard
Voltage Range: 2.5 WVDC to 50 WVDC
ORDERING INFORMATION
298D
MODEL
106
CAPACITANCE
X0
CAPACITANCE
TOLERANCE
010
DC VOLTAGE RATING
AT + 85 °C
M2
CASE CODE TERMINATION
T
REEL SIZE AND
PACKAGING
This is expressed in
picofarads. The first two
digits are the significant
figures. The third is the
number of zeros to
follow.
X0 = ± 20 %
X9 = ± 10 %
This is expressed in volts.
To complete the three-digit
block, zeros precede the
voltage rating. A decimal
point is indicated by an “R”
(6R3 = 6.3 V).
See Ratings 2 = 100 % tin
and Case 4 = Gold plated
Codes table
T = Tape and reel
7" [178 mm] reel
Note
• Preferred tolerance and reel size are in bold.
We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating
DIMENSIONS in inches [millimeters]
Anode Termination
Anode Polarity Bar
Cathode Termination
CW
H
P1
CASE
K
M
R
P
A
P2 P1
L
0.039 + 0.008
[1.0 + 0.2]
0.063 ± 0.004
[1.60 ± 0.1]
0.079 ± 0.004
[2.0 ± 0.1]
0.094 ± 0.004
[2.4 ± 0.1]
0.126 ± 0.008
[3.2 ± 0.2]
W
0.02 + 0.008
[0.5 + 0.2]
0.033 ± 0.004
[0.85 ± 0.1]
0.050 ± 0.004
[1.25 ± 0.1]
0.057 ± 0.004
[1.45 ± 0.1]
0.063 ± 0.008
[1.6 ± 0.2]
H
0.024 max.
[0.6 max.]
0.031 ± 0.004
[0.80 ± 0.1]
0.060 max.
[1.5 max.]
0.043 ± 0.004
[1.10 ± 0.1]
0.063 ± 0.008
[1.6 ± 0.2]
L
P1
0.01 ± 0.004
[0.25 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.020 ± 0.004
[0.50 ± 0.1]
0.031 ± 0.004
[0.80 ± 0.1]
** Please see document “Vishay Material Category Policy” (5-2008)”: www.vishay.com/doc?99902
www.vishay.com
38
For technical questions, contact: [email protected]
P2 (REF.)
0.02
[0.5]
0.024
[0.60]
0.04
[1.0]
0.057
[1.40]
0.063
[1.60]
C
0.015 ± 0.004
[0.38 ± 0.1]
0.024 ± 0.004
[0.60 ± 0.1]
0.035 ± 0.004
[0.90 ± 0.1]
0.035 ± 0.004
[0.90 ± 0.1]
0.047 ± 0.004
[1.20 ± 0.1]
Document Number: 40065
Revision: 21-Jun-10

1 page




298D226X06R3M2T pdf
298D
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTANTM Leadframeless Molded
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD-202G Method 108A
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Humidity Tests
At 40 °C/90 % RH 500 h, no voltage
applied. MIL-STD-202G Method 103B
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Thermal Shock
At - 55 °C/+ 125 °C, 30 min each,
for 5 cycles. MIL-STD-202G Method 107G
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
AEC Q-200 rev. C Method 006
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
Substrate Bending
(Board flex)
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AEC-Q200 rev. C Method 005
Vibration
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 g peak
Shock
MIL-STD-202G, Method 213B, Condition I,
100 g peak
Resistance to Solder At 260 °C, for 10 s, reflow
Heat
Capacitance change
Dissipation factor
Leakage current
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance change
Dissipation factor
Leakage current
Refer to Standard Ratings table
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Solderability
Resistance to
Solvents
Flammability
There shall be no mechanical or visual damage to capacitors
post-conditioning.
MIL-STD-202G, Method 208H, ANSI/J-STD-002,
Test B. Applies only to solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.
www.vishay.com
42
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 21-Jun-10

5 Page





298D226X06R3M2T arduino
298D
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTANTM Leadframeless Molded
GUIDE TO APPLICATION
1. A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
Irms =
-------P--------
RESR
where,
P=
RESR =
Power dissipation in Watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
2. A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
Vrms = Z
-------P--------
RESR
or, from the formula:
Vrms = Irms × Z
where,
P=
RESR =
Z=
Power dissipation in Watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
The capacitor impedance at the specified
frequency.
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
3. Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the DC
rating at + 85 °C and 1 % of the DC rating at + 125 °C.
4. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
+ 85 °C
+ 125 °C
DERATING FACTOR
1.0
0.9
0.4
5. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
6. Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1
Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
9. Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
www.vishay.com
48
For technical questions, contact: [email protected]
Document Number: 40065
Revision: 21-Jun-10

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