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PDF 269-1 Data sheet ( Hoja de datos )
| Número de pieza | 269-1 | |
| Descripción | 269-Type14xxnmPumpLaserModulewithFiberGrating | |
| Fabricantes | AgereSystems | |
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Data Sheet
June 2001
269-Type 14xx nm Pump Laser Module
with Fiber Grating
Applications
s Raman pump modules (RPM)
s Erbium-doped fiber amplifiers (EDFA)
Description
Offering superior wavelength stability, the 269-type pump
laser module with fiber grating is designed as a continuous-
wave (CW) optical pump source for erbium-doped fiber ampli-
fiers and Raman pump modules.
Features
s High-coupled rated output power up to 280 mW,
CW
s Available with fiber grating for wavelength stability
(1420 nm—1510 nm)
s Wide environmental range
s Field-proven packaging technology
s InGaAsP/InP high-power, strained multiple quan-
tum-well (MQW) chip design
s Internal thermoelectric cooler (TEC)
s InGaAs PIN photodetector back-facet monitor
s Single-mode and polarization-maintaining fiber pig-
tails
s Compact, 14-pin butterfly package
s Industry compatible package and pinout
The 269-type pump laser module with fiber grating
represents a family of thermoelectrically cooled,
high-power lasers. These modules utilize a fiber
Bragg grating to achieve stable wavelength perfor-
mance within the 1420 nm to 1510 nm range, over
the full operating temperature range. They are
designed as continuous-wave (CW) optical pump
sources for dense wavelength-division multiplexing
(DWDM) EDFA and Raman applications operating in
the C- and L-bands. The 269-type laser modules with
polarization-maintaining fiber are particularly suitable
for use in RPM designs requiring the high-power
combinations of multiple pumps.
The laser optical spectrum is locked by the fiber grat-
ing over a wide optical power range. The optical
spectrum is very narrow and the peak wavelength is
nearly insensitive to temperature variations and back
reflections.
The laser modules incorporate a high-power, quan-
tum-well laser chip that achieves grating-stabilized
fiber powers ranging to 280 mW.
An integral thermoelectric cooler (TEC) stabilizes the
laser at room temperature and, combined with a her-
metic environment, allows the device to achieve
high-power operation over the extended temperature
range of 0 °C to 75 °C. An internal InGaAs PIN pho-
todiode, mounted behind the laser diode, functions
as the laser detector and monitors light emissions
from the rear facet of the laser.
The 269-type module is offered in a 14-pin, hermetic
butterfly package.
1 page  
Data Sheet
June 2001
269-Type 14xx nm Pump Laser Module
with Fiber Grating
User Information
Table 4. Pin Information
Pin
Number
Connection
1 TE Cooler (+)*
2 Thermistor
3 Monitor Anode (–Bias)
4 Monitor Cathode (+Bias)
5 Thermistor
6 No Connect
7 No Connect
8 No Connect
9 No Connect
10 Laser Anode (+)
11 Laser Cathode (–)
12 No Connect
13 Package Ground
14 TEC Cooler (–)
* A positive input into this pin cools the laser.
Fiber Characteristics
s Length of fiber pigtail:
— 1.75 m ± 0.25 m
s Length of fiber pigtail to end of grating:
— 0.86 m ± 0.14 m
s Standard fiber:
— Cladding OD: 125 µm ± 2 µm
— Acrylate buffer OD: 250 µm ± 15 µm
— Cut off wavelength: <1320 nm
s Polarization-maintaining fiber:
— PANDA
— Cut off wavelength: <1400 nm
— Acrylate buffer: 400 µm
Mounting and Connections
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge.
Proper precautions should be taken
during both handling and testing.
The base of the laser module (see Outline Diagram)
should be maintained at or below 75 °C (maximum)
during operation. Interfaces between the laser module
base and heat sink must be clean, and the use of a
thermal filler may be necessary.
Mounting Instructions
The minimum fiber bend radius is 1.0 in.
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom flange of the module on a flat heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm)
in size. The surface finish of the heat sink should be
better than 32 µin. (0.8 µm), and the surface flat-
ness must be better than 0.001 in. (25.4 µm). Using
thermal conductive grease is optional; however,
thermal performance may be improved if conductive
grease is applied between the bottom flange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see
Outline Diagram). The Fillister head diameter must
not exceed 0.140 in. (3.55 mm). Do not apply more
than 1 in./lb. of torque to the screws.
7 65 43 21
+–
TH 10 kΩ
TEC
Agere Systems Inc.
+–
8 9 10 11 12 13 14
Figure 1. Circuit Schematic
1-675 (F).h
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet 269-1.PDF ] | |
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