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PDF BCP52 Data sheet ( Hoja de datos )

Número de pieza BCP52
Descripción 60V 1A PNP medium power transistors
Fabricantes NXP Semiconductors 
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No Preview Available ! BCP52 Hoja de datos, Descripción, Manual

BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
Rev. 9 — 18 October 2011
Product data sheet
1. Produc t profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP52
SOT223
BCX52
SOT89
BC52PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
NPN complement
BCP55
BCX55
BC55PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
ICM
Quick reference data
Parameter
Conditions
collector-emitter voltage open base
collector current
peak collector current single pulse; tp 1 ms
Min Typ Max Unit
- - 60 V
- - 1 A
- - 2 A
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BCP52 pdf
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
1.5
Ptot
(W)
1.0
0.5
(1)
(2)
(3)
006aac674
1.5
Ptot
(W)
1.0
(1)
(2)
(3)
0.5
006aac675
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
2.0
Ptot
(W)
1.5
1.0
0.5
(1)
(2)
(3)
(4)
(5)
0.0
–75
–25
25
75 125 175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 2. Power derating curves SOT89
006aac676
0.0
–75
–25
25
75
(1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm2
(2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
(3) FR4 PCB, single-sided copper, mounting pad for collector 1 cm2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig 3. Power derating curves SOT1061
125 175
Tamb (°C)
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
5 of 22

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BCP52 arduino
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
006aac685
10
0.02
0.01
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, single-sided copper, mounting pad for collector 6 cm2
Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.5
0.25
0.75
0.33
0.2
0.1
0.05
0.02
10
0.01
006aac686
10–1
10–5
10–4
10–3
10–2
10–1
1
10 102 103
tp (s)
FR4 PCB, 4-layer copper, standard footprint
Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061;
typical values
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
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