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Número de pieza | BAS21SH | |
Descripción | Fast Switching Diodes | |
Fabricantes | CYStech Electronics | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BAS21SH (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! CYStech Electronics Corp.
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 1/5
Fast Switching Diodes
BAS21SH
SOD-123
Features
•Fast switching speed
•Low forward voltage drop
•Pb-free lead plating package
Mechanical Data
• Case: Molded plastic, JEDEC SOD-123.
• Terminals: Pure tin plated, solderable per MIL-STD-202 method 208
• Polarity: Indicated by cathode band.
• Weight: 0.01 gram approximately
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Symbol
Non-repetitive peak reverse voltage
Repetitive peak reverse voltage
Working peak reverse voltage
RMS voltage
DC blocking voltage
Forward continuous current
Average rectified output current
Peak forward surge current @
t=1ms
t=1s
Repetitive peak forward current
Power dissipation
Thermal resistance, Junction to ambient
Operating and storage temperature range
VRM
VRRM
VRWM
VRMS
VR
IFM
IO
IFSM
IFRM
PD
RθJA
TJ;TSTG
Type
250
250
250
141
250
400
200
2.5
0.5
625
500
250
-65 ~ +150
Units
V
mA
A
mA
mW
℃/W
℃
Ordering Information
Device
BAS21SH
Package
SOD-123
(Pb-free lead plating package)
BAS21H
Shipping
3000 pcs / Tape & Reel
Marking
T3
CYStek Product Specification
http://www.Datasheet4U.com
1 page SOD-123 Dimension
CYStech Electronics Corp.
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 5/5
Marking:
T3
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Style: Pin 1.Cathode 2.Anode
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.102 0.110 2.600 2.800 D 0.018 0.026 0.450 0.650
B 0.059 0.067 1.500 1.700 E 0.140 0.152 3.550 3.850
C 0.041 0.049 1.050 1.250
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS21H
CYStek Product Specification
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet BAS21SH.PDF ] |
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