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PDF BAS21SH Data sheet ( Hoja de datos )

Número de pieza BAS21SH
Descripción Fast Switching Diodes
Fabricantes CYStech Electronics 
Logotipo CYStech Electronics Logotipo



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No Preview Available ! BAS21SH Hoja de datos, Descripción, Manual

CYStech Electronics Corp.
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 1/5
Fast Switching Diodes
BAS21SH
SOD-123
Features
Fast switching speed
Low forward voltage drop
Pb-free lead plating package
Mechanical Data
Case: Molded plastic, JEDEC SOD-123.
Terminals: Pure tin plated, solderable per MIL-STD-202 method 208
Polarity: Indicated by cathode band.
Weight: 0.01 gram approximately
Maximum Ratings and Electrical Characteristics
(Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Symbol
Non-repetitive peak reverse voltage
Repetitive peak reverse voltage
Working peak reverse voltage
RMS voltage
DC blocking voltage
Forward continuous current
Average rectified output current
Peak forward surge current @
t=1ms
t=1s
Repetitive peak forward current
Power dissipation
Thermal resistance, Junction to ambient
Operating and storage temperature range
VRM
VRRM
VRWM
VRMS
VR
IFM
IO
IFSM
IFRM
PD
RθJA
TJ;TSTG
Type
250
250
250
141
250
400
200
2.5
0.5
625
500
250
-65 ~ +150
Units
V
mA
A
mA
mW
/W
Ordering Information
Device
BAS21SH
Package
SOD-123
(Pb-free lead plating package)
BAS21H
Shipping
3000 pcs / Tape & Reel
Marking
T3
CYStek Product Specification
http://www.Datasheet4U.com

1 page




BAS21SH pdf
SOD-123 Dimension
CYStech Electronics Corp.
Spec. No. : C335SH
Issued Date : 2011.05.10
Revised Date : 2012.06.28
Page No. : 5/5
Marking:
T3
2-Lead SOD-123 Plastic
Surface Mounted Package
CYStek Package Code: SH
Style: Pin 1.Cathode 2.Anode
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.102 0.110 2.600 2.800 D 0.018 0.026 0.450 0.650
B 0.059 0.067 1.500 1.700 E 0.140 0.152 3.550 3.850
C 0.041 0.049 1.050 1.250
Notes: 1.Controlling dimension : millimeters.
2.Lead thickness specified per L/F drawing with solder plating.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS21H
CYStek Product Specification

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