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PDF PC28F00AP30BFB Datasheet ( Hoja de datos )

Número de pieza PC28F00AP30BFB
Descripción Micron Parallel NOR Flash Embedded Memory (P30-65nm)
Fabricantes MICRON 
Logotipo MICRON Logotipo

Total 30 Páginas
		
PC28F00AP30BFB Hoja de datos, Descripción, Manual
512Mb, 1Gb, 2Gb: P30-65nm
Features
Micron Parallel NOR Flash Embedded
Memory (P30-65nm)
JS28F512P30BFx, JS28F512P30EFx, JS28F512P30TFx,
PC28F512P30BFx, PC28F512P30EFx, PC28F512P30TFx
JS28F00AP30BFx, JS28F00AP30TFx, JS28F00AP30EFx,
PC28F00AP30BFx, PC28F00AP30TFx, PC28F00AP30EFx,
RC28F00AP30BFx, RC28F00AP30TFx, PC28F00BP30EFx
Features
• High performance
• Easy BGA package features
– 100ns initial access for 512Mb, 1Gb Easy BGA
– 105ns initial access for 2Gb Easy BGA
– 25ns 16-word asychronous page read mode
– 52 MHz (Easy BGA) with zero WAIT states and
17ns clock-to-data output synchronous burst
read mode
– 4-, 8-, 16-, and continuous word options for burst
mode
• TSOP package features
– 110ns initial access for 512Mb, 1Gb TSOP
• Both Easy BGA and TSOP package features
– Buffered enhanced factory programming (BEFP)
at 2 MB/s (TYP) using a 512-word buffer
– 1.8V buffered programming at 1.46 MB/s (TYP)
using a 512-word buffer
• Architecture
– MLC: highest density at lowest cost
– Symmetrically blocked architecture (512Mb, 1Gb,
2Gb)
– Asymmetrically blocked architecture (512Mb,
1Gb); four 32KB parameter blocks: top or bottom
configuration
– 128KB main blocks
– Blank check to verify an erased block
• Voltage and power
– VCC (core) voltage: 1.7–2.0V
– VCCQ (I/O) voltage: 1.7–3.6V
– Standy current: 70µA (TYP) for 512Mb; 75µA
(TYP) for 1Gb
– 52 MHz continuous synchronous read current:
21mA (TYP), 24mA (MAX)
• Security
– One-time programmable register: 64 OTP bits,
programmed with unique information from Mi-
cron; 2112 OTP bits available for customer pro-
gramming
– Absolute write protection: VPP = VSS
– Power-transition erase/program lockout
– Individual zero-latency block locking
– Individual block lock-down
– Password access
• Software
25μs (TYP) program suspend
25μs (TYP) erase suspend
– Flash Data Integrator optimized
– Basic command set and extended function Inter-
face (EFI) command set compatible
– Common flash interface
• Density and Packaging
– 56-lead TSOP package (512Mb, 1Gb)
– 64-ball Easy BGA package (512Mb, 1Gb, 2Gb)
– 16-bit wide data bus
• Quality and reliabilty
– JESD47 compliant
– Operating temperature: –40°C to +85°C
– Minimum 100,000 ERASE cycles per block
– 65nm process technology
PDF: 09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
http://www.Datasheet4U.com

1 page

PC28F00AP30BFB pdf
512Mb, 1Gb, 2Gb: P30-65nm
Features
List of Figures
Figure 1: Easy BGA Block Diagram ................................................................................................................... 8
Figure 2: Memory Map – 512Mb and 1Gb ......................................................................................................... 9
Figure 3: Memory Map – 2Gb ......................................................................................................................... 10
Figure 4: 56-Pin TSOP – 14mm x 20mm .......................................................................................................... 11
Figure 5: 64-Ball Easy BGA – 8mm x 10mm x 1.2mm ....................................................................................... 12
Figure 6: 56-Lead TSOP Pinout – 512Mb and 1Gb ........................................................................................... 13
Figure 7: 64-Ball Easy BGA (Top View – Balls Down) – 512Mb, 1Gb, and 2Gb .................................................... 14
Figure 8: Example VPP Supply Connections .................................................................................................... 31
Figure 9: Block Locking State Diagram ........................................................................................................... 35
Figure 10: First Access Latency Count ............................................................................................................ 40
Figure 11: Example Latency Count Setting Using Code 3 ................................................................................. 41
Figure 12: End of Wordline Timing Diagram ................................................................................................... 41
Figure 13: OTP Register Map .......................................................................................................................... 46
Figure 14: Word Program Procedure ............................................................................................................... 62
Figure 15: Buffer Program Procedure .............................................................................................................. 63
Figure 16: Buffered Enhanced Factory Programming (BEFP) Procedure ........................................................... 64
Figure 17: Block Erase Procedure ................................................................................................................... 65
Figure 18: Program Suspend/Resume Procedure ............................................................................................ 66
Figure 19: Erase Suspend/Resume Procedure ................................................................................................. 67
Figure 20: Block Lock Operations Procedure ................................................................................................... 68
Figure 21: OTP Register Programming Procedure ............................................................................................ 69
Figure 22: Status Register Procedure .............................................................................................................. 70
Figure 23: Reset Operation Waveforms ........................................................................................................... 72
Figure 24: AC Input/Output Reference Timing ................................................................................................ 76
Figure 25: Transient Equivalent Load Circuit .................................................................................................. 76
Figure 26: Clock Input AC Waveform .............................................................................................................. 76
Figure 27: Asynchronous Single-Word Read (ADV# LOW) ................................................................................ 80
Figure 28: Asynchronous Single-Word Read (ADV# Latch) ............................................................................... 80
Figure 29: Asynchronous Page Mode Read ...................................................................................................... 81
Figure 30: Synchronous Single-Word Array or Nonarray Read .......................................................................... 82
Figure 31: Continuous Burst Read with Output Delay ..................................................................................... 83
Figure 32: Synchronous Burst Mode 4-Word Read ........................................................................................... 84
Figure 33: Write to Write Timing .................................................................................................................... 87
Figure 34: Asynchronous Read to Write Timing ............................................................................................... 87
Figure 35: Write to Asynchronous Read Timing ............................................................................................... 88
Figure 36: Synchronous Read to Write Timing ................................................................................................ 89
Figure 37: Write to Synchronous Read Timing ................................................................................................ 90
PDF: 09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN
5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.

5 Page

PC28F00AP30BFB arduino
Package Dimensions
Figure 4: 56-Pin TSOP – 14mm x 20mm
512Mb, 1Gb, 2Gb: P30-65nm
Package Dimensions
Pin #1 index
See notes 2
See note 2
0.15 ±0.05
+2°
-3°
20 ±0.2
18.4 ±0.2
See note 2
See note 2
0.995 ±0.03
0.5 TYP
14.00 ±0.2
0.22 ±0.05
0.25 ±0.1
See Detail A
1.20 MAX
0.10
Seating
plane
0.05 MIN
0.60 ±0.10
Detail A
Notes:
1. All dimensions are in millimeters. Drawing not to scale.
2. One dimple on package denotes pin 1; if two dimples, then the larger dimple denotes
pin 1. Pin 1 will always be in the upper left corner of the package, in reference to the
product mark.
3. For the lead width value of 0.22 ±0.05, there is also a legacy value of 0.15 ±0.05.
PDF: 09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.

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