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Número de pieza NCV7383
Descripción Bus Driver
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NCV7383
FlexRay] Bus Driver
NCV7383 is a single channel FlexRay bus driver compliant with
the FlexRay Electrical Physical Layer Specification Rev . 3.0.1,
capable of communicating at speeds of up to 10 Mbit/s. It provides
differential transmit and receive capability between a wired FlexRay
communication medium on one side and a protocol controller and
a host on the other side.
NCV7383 mode control functionality is optimized for nodes
without the need of extended power management provided by
transceivers with permanent connection to the car battery as is on
NCV7381. NCV7383 is primarily intended for nodes switched off by
ignition.
It of fers excellent Electromagnetic compatibility (EMC) and
Electrostatic discharge (ESD) performance.
KEY FEATURES
General
Compliant with FlexRay Electrical Physical Layer Specification Rev 3.0.1
FlexRay Transmitter and Receiver in NormalPower Modes for
Communication up to 10 Mbit/s
Support of 60 ns Bit Time
FlexRay LowPower Mode Receiver for Remote Wakeup Detection
Excellent Electromagnetic Susceptibility (EMS) Level Over Full
Frequency Range. Very Low Electromagnetic Emissions (EME)
Bus Pins Protected Against >10 kV System ESD Pulses
Safe Behavior Under Missing Supply or No Supply Conditions
Interface Pins for a Protocol Controller and a Host (TxD, RxD,
TxEN, STBN, BGE, ERRN, CSN, SCK, SDO)
Supply Pins VCC, VIO with Independent Voltage Ramp Up:
VCC Supply Parametrical Range from 4.75 V to 5.25 V
VIO Supply Parametrical Range from 2.3 V to 5.25 V
TxEN Timeout and BGE Feedback
Two Error Indication Modes
Track mode Error Signaling on ERRN Pin
Latched mode Status Register accessible via SPI
Compatible with 14 V and 28 V Systems
Operating Ambient Temperature 40°C to +125°C (TAMB_Class1)
Junction Temperature Monitoring
TSSOP14 Package
These are PbFree Devices
FlexRay Functional Classes
Bus Driver Bus Guardian Interface
Bus Driver Logic Level Adaptation
Bus Driver Remote Wakeup
Quality
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
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14
1
TSSOP14
CASE 948G
MARKING
DIAGRAM
14
NV73
830
ALYWG
1
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
VIO
TxD
TxEN
RxD
BGE
STBN
SCK
PIN CONNECTIONS
1
(Top View)
VCC
BP
BM
GND
ERRN
CSN
SDO
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 20 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
September, 2013 Rev. 0
1
Publication Order Number:
NCV7383/D
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NCV7383 pdf
NCV7383
supplied until V CC supply voltage is above uVCC_PORH
threshold (VCC > uVCC_PORH) See Table 3.
Both supplies are monitored by undervoltage detectors
with individual thresholds and filtering times both for
undervoltage detection and recovery see Table 15.
Junction Temperature Monitoring
In order to protect the NCV7383 from being damaged in
case of thermal event, a junction temperature monitoring is
implemented. High ambient temperature together with the
device high power dissipation can lead to junction
temperature reaching a critical temperature. Under certain
failure conditions (e.g. bus pin shorted to the supply voltage
during the transmitter active state), the device power
dissipation can be rapidly increased even though the
absolute short current is limited. If the junction temperature
is higher than TJSD (typically 165 °C) in Normal mode,
Thermal Shutdown flag is set and the transmitter is disabled.
This will reduce the power dissipation and decrease the
junction temperature.
The transmitter is enabled as soon as the Thermal
Shutdown flag is cleared. This requires the junction
temperature falling below the Thermal Shutdown level and
TxEN pin being set to High in Normal mode.
Logic Level Adaptation
Level shift input VIO is used to apply a reference voltage
uVDIG = uVIO to all digital inputs and outputs in order to
adapt the logical levels of NCV7383 to the host and/or the
FlexRay communication controller digital signal levels.
Internal Flags
The NCV7383 control logic uses a number of internal
flags (i.e. one bit memories) reflecting important
conditions or events. T able 3 summarizes the individual
flags and the conditions that lead to a set or reset of the flags.
Table 3. INTERNAL FLAGS
Flag
Set Condition
Remote
Wakeup
VCC Undervoltage flag is not set
and
Remote Wakeup is detected in Standby
mode
Mode
Normal mode is entered
Transmitter
Ready
All of the following terms are valid:
The bus driver is in Normal mode
TxEN Timeout flag is not set
BGE is High
Thermal Shutdown flag is not set
Poweron
VCC power supply level becomes sufficient
for the operation of the control logic
Bus Error
Transmitter is enabled
and
Data on bus are different from TxD signal
(sampled after each TXD edge)
Thermal
Shutdown
Junction temperature is higher than Tjsd
(typ. 165°C) in a Normal mode
TxEN Time-
out
VCC
Undervolt-
age
TxEN is Low for longer than dBDTxAct-
iveMax (typ. 1.5 ms) in a Normal mode
VCC is below the undervoltage threshold
for longer than dBDUVVCC
Reset Condition
Normal mode is entered
Normal mode is left
Any of the following terms is valid:
The bus driver is not in Normal mode
TxEN Timeout flag is set
BGE is Low
Thermal Shutdown flag is set
Normal mode is entered
(Transmitter is enabled
and
Data on bus are identical to TxD signal)
or
TxEN is set High or Normal mode is left
Junction temperature is below Tjsd in
a Normal mode and TxEN is High
or
Normal mode is left
TxEN is High
or
Normal mode is left
VCC is above the undervoltage thresh-
old
for longer than dBDRVCC
Comment
RxD and ERRN are set
Low if Remote Wakeup
flag is set and STBN is
Low
The bus error flag has no
influence on the bus driver
function
The transmitter is disabled
as long as the thermal
shutdown flag is set
The transmitter is disabled
as long as the timeout flag
is set
Standby mode is forced
as long as the VCC UV
flag is set
VIO
Undervolt-
age
VIO is below the undervoltage threshold
for longer than dUVIO
VIO is above the undervoltage thresh-
old
for longer than dBDRVIO
or
Remote Wakeup flag becomes set
Standby mode is forced
as long as the VIO UV flag
is set
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NCV7383 arduino
NCV7383
ABSOLUTE MAXIMUM RATINGS
Table 8. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min Max Unit
uVCCMAX
uVIOMAX
uDigInMAX
uDigOutMAX
iDigOutINMAX
uBMMAX
uBPMAX
TJ_MAX
TSTG
uESDIEC
5V Supply voltage
Supply voltage for VIO voltage level adaptation
DC voltage at digital inputs (STBN, TxD, TxEN, BGE, SCSN, SCLK)
DC voltage at digital Outputs (RxD, ERRN, SDO)
Digital output pins input current (VIO = 0 V)
DC voltage at pin BM
DC voltage at pin BP
Junction temperature
Storage Temperature Range
System HBM on pins BP and BM
(as per IEC 6100042; 150 pF/330 W)
0.3
0.3
0.3
0.3
10
50
50
40
55
10
5.5
5.5
5.5
VIO+0.3
10
50
50
175
150
+10
V
V
V
V
mA
V
V
°C
°C
kV
uESDEXT
Component HBM on pins BP, BM
(as per EIAJESD22A114B; 100 pF/1500 W)
8 +8 kV
uESDINT
Component HBM on all other pins
(as per EIAJESD22A114B; 100 pF/1500 W)
4 +4 kV
uVTRAN
Voltage transients, pins BP and BM
According to ISO76372, Class C (Note 4)
test pulses 1
test pulses 2a
100
V
+75 V
test pulses 3a
150
V
test pulses 3b
+100
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only . Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. Test is carried out according to setup in FlexRay Physical Layer EMC Measurement Specification, Version 3.0. This specification is referring
to ISO7637. Test for higher voltages is planned.
OPERATING RANGES
Table 9. NCV7383: OPERATING RANGES
Symbol
Parameter
uVCCOP
uVIOOP
uDigIOOP
Supply voltage 5 V
Supply voltage for VIO voltage level adaptation
DC voltage at digital pins (TxD, TxEN, RxD, BGE, STBN, ERRN, SCSN,
SCLK, SDO)
uBMOP
DC voltage at pin BM
uBPOP
DC voltage at pin BP
TAMB
Ambient temperature (Note 5)
TJ_OP
Junction temperature
5. The specified range corresponds to TAMB_Class1
Min
4.75
2.3
0
50
50
40
40
Max
5.25
5.25
VIO
50
50
125
150
Unit
V
V
V
V
V
°C
°C
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