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PDF BD3702FV Data sheet ( Hoja de datos )

Número de pieza BD3702FV
Descripción Silicon Monolithic Integrated Circuit
Fabricantes ROHM Semiconductor 
Logotipo ROHM Semiconductor Logotipo



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PRODUCTS
TYPE
SEMICONDUCTOR IC
BD3702FV
PAGE
1/4
Structure
Product
Type
Package
:
:
:
:
Silicon Monolithic Integrated Circuit
Sound Processor for car audio
BD3702FV
SSOP-B28
Feature
1. Reduce switching noise of input gain control, mute, main volume, fader volume, bass, middle, treble, loudness,
mixing by using advanced switch circuit [Possible to control all steps]
2. Built-in ground isolation amplifier inputs, ideal for external stereo input.
3. Built-in differential input selector that can make various combination of single-ended / differential input.
4. Built-in input gain controller reduce switching noise for volume of a portable audio input.
5. Decrease the number of external components by built-in 3-band equalizer filter, LPF for subwoofer, loudness filter.
And, possible to control Q, Gv, fo of 3-band equalizer and fc of LPF, fo, Gv of loudness by I2C BUS control freely.
6. It is possible for the bass, middle, treble to the gain adjustment quantity of ±20dB and 1 dB step gain adjustment.
7. It is equipped with output terminals of Subwoofer. Moreover, the stereo signal of the front and rear also can be
output by the I2C BUS control.
8. Built-in mixing input and mixing attenuation.
9. Bi-CMOS process is suitable for the design of low current and low energy. And it provides more quality for
small-scale regulator and heat in a set.
10. Package is SSOP-B28. Putting input-terminals together and output-terminals together can make
PCB layout easier and can makes area of PCB smaller.
11. It is possible to control by 3.3V / 5V for I2C BUS.
Absolute Maximum Ratings (Ta=25)
Parameter
Symbol
Limits
Unit
Power supply Voltage
Input voltage
Power Dissipation
Storage Temperature
VCC
VIN
Pd
Tastg
10.0
VCC+0.3GND-0.3
1063 1
-55+150
V
V
mW
1 At Ta25°C or higher, this value is decreaced to 8.5mW/°C
When Rohm standard board is mounted.
Rohm standard board:
Size70×70×1.6(mm3)
materialFR4 glass-epoxy substrate (copper foil area: not more than 3%).
Operating Range
Parameter
Symbol
Power supply Voltage
VCC
Temperature
Topr
Design against radiation-proof isn’t made.
Min. Typ. Max.
7.0 9.5
-40 +85
Unit
V
Status of this document
The Japanese version of this document is the formal specification. A customer may use this translation only for a reference to help
reading the formal version. If there are any differences in translation version of this document, formal version takes priority.
Application example
ROHM cannot provide adequate confirmation of patents.
The product described in this specification is designed to be used with ordinary electronic equipment or device (such as audio-visual equipment,
office-automation equipment, communications devices, electrical appliances, and electronic toys.)
Should you intend to use this product with equipment or devices which require an extremely high level of reliability and the malfunction of which
would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers,
fuel controllers and other safety device), please be sure to consult with our sales representative in advance.
ROHM assumes no responsibility for use of any circuits described herein, conveys no license under any patent or other right, and makes no
representations that the circuits are free from patent infringement.
DESIGN
CHECK
APPROVAL
DATE:
25/Nov/2008
SPECIFICATION No. TSZ02201-BD3702FV-1-2
TSZ22111・04
REV.
B
ROHM CO.,LTD.

1 page




BD3702FV pdf
PRODUCTS
TYPE
SEMICONDUCTOR IC
BD3702FV
*** 改訂履歴 ***
REV A REV B
ページ
3/4
内容
Dimensional outline drawing BS3700FV -> BD3702FV
PAGE
5/4
ROHM CO.,LTD. REV.:
TSZ22111・05
B
SPECIFICATION No.:
TSZ02201-BD3702FV-1-2

5 Page










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