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PDF IP4264CZ8-20-TTL Data sheet ( Hoja de datos )
| Número de pieza | IP4264CZ8-20-TTL | |
| Descripción | (IP4264CZ8-10/-20/-40-TTL) Integrated (U)SIM card passive filter array | |
| Fabricantes | NXP Semiconductors | |
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IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
Rev. 2 — 12 October 2011
Product data sheet
1. Product profile
1.1 General description
The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel
RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in
the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection
to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV
contact and higher than 25 kV air discharge, far exceeding IEC 61000-4-2, level 4.
The devices support ESD protection of the USB data pins of a Universal Subscriber
Identity Module (USIM) interface, as well as the digital standard SIM interface
ESD protection and ElectroMagnetic Interface (EMI) filtering.
The devices are fabricated using monolithic silicon technology. They integrate three
resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack
No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all
three devices ideal for use in applications requiring component miniaturization, such as
mobile phone handsets, cordless telephones and personal digital devices.
Similar products are available in Wafer Level Chip-Size Package (WLCSP).
IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces.
IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and
IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
3-channel SIM card interface integrated RC-filter array and SIM voltage
ESD protection
2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance
Integrated 100 /100 /47 series channel resistors
Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL)
or 40 pF (IP4264CZ8-40-TTL)
Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2
Micropak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
SIM interfaces in for example, cellular phone and Personal Communication
System (PCS) mobile handsets
Free Datasheet http://www.datasheet4u.net/
1 page  
NXP Semiconductors
IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
7. Application information
7.1 Insertion loss
The devices are designed as EMI/Radio Frequency Interference (RFI) filters for SIM card
interfaces. The setup for measuring return loss is shown in Figure 1.
The insertion loss in a 50 system for all three channels of
IP4264CZ8-10-TTL (Cch = 10 pF) is shown in Figure 2. The same measurements for
IP4264CZ8-20-TTL (Cch = 20 pF) are shown in Figure 3. The insertion loss for
IP4264CZ8-40-TTL (Cch = 10 pF) is shown in Figure 4.
0
S21
(dB)
–10
018aaa145
(1)
DUT
IN OUT
50 Ω TEST BOARD
50 Ω
Vgen
018aaa016
Fig 1. Frequency response setup
–20
–30 (2)
–40
10–1
1
(3)
10 102 103 104
f (MHz)
Cch = 10 pF
(1) Pin 2 to 7
(2) Pin 1 to 8
(3) Pin 3 to 6
Fig 2. IP4264CZ8-10-TTL: Frequency response
curves
IP4264CZ8-10_20_40-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 October 2011
© NXP B.V. 2011. All rights reserved.
5 of 15
Free Datasheet http://www.datasheet4u.net/
5 Page 
NXP Semiconductors
IP4264CZ8-10/20/40-TTL
Integrated (U)SIM card passive filter array with ESD protection
8. Package outline
HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.55 mm
SOT1166-1
X
D BA
E
terminal 1
index area
terminal 1
index area
L
e
1
e1
b
4
Eh
v CAB
wC
k
A
A1
detail X
y1 C
C
y
c
85
Dh
tiebars are indicated on
arbitrary location and size
Dimensions
0 1 2 mm
scale
Unit(1)
A A1 b c D Dh E Eh e e1 k L v w y y1
max 0.55 0.05 0.25
1.8 1.3 1.45 0.45
0.30
mm nom
0.20 0.127 1.7 1.2 1.35 0.40 0.4 1.2
0.25 0.1 0.05 0.05 0.05
min 0.00 0.15 1.6 1.1 1.25 0.35
0.2 0.20
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT1166-1
---
---
---
Fig 11. Package outline SOT1166-1 (HUSON8)
IP4264CZ8-10_20_40-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 October 2011
sot1166-1_po
Issue date
10-03-18
10-03-22
© NXP B.V. 2011. All rights reserved.
11 of 15
Free Datasheet http://www.datasheet4u.net/
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