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PDF T60N02R Data sheet ( Hoja de datos )
| Número de pieza | T60N02R | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD60N02R
Power MOSFET
62 A, 24 V, N−Channel, DPAK
Features
• Planar HD3e Process for Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Ciss to Minimize Driver Loss
• Low Gate Charge
• Optimized for High Side Switching Requirements in
High−Efficiency DC−DC Converters
• Pb−Free Packages are Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance
Junction−to−Case
Total Power Dissipation @ TC = 25°C
Drain Current
Continuous @ TC = 25°C, Chip
Continuous @ TC = 25°C, Limited by Package
Continuous @ TA = 25°C, Limited by Wires
VDSS
VGS
RqJC
PD
ID
ID
ID
24 Vdc
±20 Vdc
2.6 °C/W
58 W
62 A
50 A
32 A
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
RqJA
PD
ID
80 C/W
1.87 W
10.5 A
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C
Operating and Storage Temperature
RqJA
PD
ID
TJ, and
Tstg
120 °C/W
1.25 W
8.5 A
−55 to °C
175
Single Pulse Drain−to−Source Avalanche Energy
− Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10.0 Vdc,
IL = 11 Apk, L = 1.0 mH, RG = 25 W)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
TL
60 mJ
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 in sq drain pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
V(BR)DSS
24 V
RDS(on) TYP
8.4 mW @ 10 V
ID MAX
62 A
N−Channel
D
G
S
44
4
12
3
12
3
1
2
3
CASE 369AA CASE 369C
CASE 369D
DPAK
DPAK
DPAK
(Surface Mount) (Surface Mount) (Straight Lead)
STYLE 2
STYLE 2
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENTS
4
Drain
4
Drain
1
Gate
2
Drain
3
Source
12 3
Gate Drain Source
Y = Year
WW = Work Week
60N02R = Device Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
December, 2004 − Rev. 10
1
Publication Order Number:
NTD60N02R/D
Free Datasheet http://www.datasheet4u.com/
1 page  
NTD60N02R
1.0
D = 0.5
0.2
0.1
0.1 0.05
0.02
0.01
SINGLE PULSE
0.01
0.00001
0.0001
P(pk)
RqJC(t) = r(t) RqJC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
t1 READ TIME AT t1
t2 TJ(pk) − TC = P(pk) RqJC(t)
DUTY CYCLE, D = t1/t2
0.001 0.01 0.1 1 10
t, TIME (s)
Figure 12. Thermal Response
ORDERING INFORMATION
Order Number
Package
Shipping†
NTD60N02R
DPAK−3
75 Units / Rail
NTD60N02RG
DPAK−3
(Pb−Free)
75 Units / Rail
NTD60N02RT4
DPAK−3
2500 / Tape & Reel
NTD60N02RT4G
DPAK−3
(Pb−Free)
2500 / Tape & Reel
NTD60N02R−001
DPAK−3 Straight Lead
75 Units / Rail
NTD60N02R−1G
DPAK−3 Straight Lead
(Pb−Free)
75 Units / Rail
NTD60N02R−032
DPAK−3 Straight Lead
(3.2 ± 0.5 mm)
75 Units / Rail
NTD60N02R−032G
DPAK−3 Straight Lead
(3.2 ± 0.5 mm)
(Pb−Free)
75 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi-
cations Brochure, BRD8011/D.
http://onsemi.com
5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
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| PDF Descargar | [ Datasheet T60N02R.PDF ] | |
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