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PDF BD3574HFP Data sheet ( Hoja de datos )

Número de pieza BD3574HFP
Descripción (BD3570FP - BD3575HFP) High Voltage LDO Regulators
Fabricantes ROHM Semiconductor 
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Power Management IC Series for Automotive Body Control
High Voltage
LDO Regulators
BD3570FP, BD3570HFP, BD3571FP, BD3571HFP, BD3572FP, BD3572HFP
BD3573FP, BD3573HFP, BD3574FP, BD3574HFP, BD3575FP, BD3575HFP
No.11036EBT02
Description
BD357XFP/HFP SERIES regulators feature a high 50 V withstand-voltage and are suitable for use with onboard vehicle
microcontrollers. They offer the output current of 500 mA while limiting the quiescent current to 30μA (TYP).With these
devices, a ceramic capacitor can be selected at the output for stable operation, the output tolerance is within ±2% over the
wide ambient temperature range (-40 to 125), and the short circuit protection is folded-type to minimize generation of
heat during malfunction. These devices are developed to offer most robust power-supply design under the harsh
automotive environment. The BD357XFP/HFP Series provide ideal solutions to lower the current consumption as well as to
simplify the use with battery direct-coupled systems.
Features
1) Ultra-low quiescent current: 30μA (TYP.)
2) Low-saturation voltage type P-channel DMOS output transistors
3) High output voltage precision: 2%Iomax = 500 mA
4) Low-ESR ceramic capacitors can be used as output capacitors.
5) Vcc power supply voltage = 50 V
6) Built-in overcurrent protection circuit and thermal shutdown circuit
7) TO252-3, TO252-5, HRP5 Package
Applications
Onboard vehicle devices (body-control, car stereos, satellite navigation systems, etc.)
Line up matrix
BD3570FP/HFP BD3571FP/HFP BD3572FP/HFP BD3573FP/HFP BD3574FP/HFP BD3575FP/HFP
Output voltage
SW function
3.3V
5.0 V
Variable
3.3V
5.0 V
Variable
Package
FP:TO252-3,TO252-5
HFP:HRP5
Absolute maximum ratings (Ta=25)
Parameter
Symbol
Limit
Unit
Supply voltage
VCC 50 1 V
Switch Supply voltage
VSW
50 2 V
Output current
IO 500 mA
1.2 (TO252-3) 3
Power dissipation
Pd
1.3 (TO252-5) 4
W
1.6 (HRP5) 5
Operating temperature range
Topr
-40 to +125
Storage temperature range
Tstg
-55 to +150
Maximum junction
temperature
Tjmax
150
1 Not to exceed Pd and ASO.
2 for ON/OFF SW Regulator only
3 TO252-3: Reduced by 9.6 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
4 TO252-5: Reduced by 10.4 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
5 HRP5: Reduced by 12.8 mW/over 25 , when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm).
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

1 page




BD3574HFP pdf
BD3570FP/HFP, BD3571FP/HFP, BD3572FP/HFP, BD3573FP/HFP
BD3574FP/HFP, BD3575FP/HFP
Technical Note
Output Voltage Adjustment
Vo
R2
ADJ R1
Fig.22
To set the output voltage insert pull-down resistor R1 between the ADJ and GND pins,
and pull-up resistor R2 between the VO and ADJ pins.
Vo = VADJ×(R1+R2) / R1 [V]
VADJ=1.26V(TYP.)
The recommended connection resistor for the ADJ-GND is 30k150kΩ.
Setting of Heat
TO252-3
2.0
IC mounted on a ROHM standard board
1.6
Substrate size: 70 mm 70 mm 1.6 mm
ja = 104.2 (°C/W)
1.2 W
1.2
2.0
1.6
1.3W
1.2
TO252-5
IC mounted on a ROHM standard board
Substrate size: 70 mm 70 mm 1.6 mm
ja = 96.2 (°C/W)
2.0
1.6 W
1.6
1.2
HRP5
IC mounted on a ROHM standard board
Substrate size: 70 mm 70 mm 1.6 mm
ja = 78.1 (°C/W)
0.8 0.8
0.8
0.4
0
0
0.4
25 50 75 100 125
AMBIENT TEMPERATURE: Ta [°C]
150
Fig. 23
0
0
25 50 75 100 125
AMBIENT TEMPERATURE: Ta []
150
Fig. 24
0.4
0
0
25 50 75 100 125
AMBIENT TEMPERATURE: Ta [°C]
150
Fig. 25
Refer to the heat mitigation characteristics illustrated in Figs. 23, 24 and 25 when using the IC in an environment where Ta
25. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of
the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or damaged. It is necessary to give
sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage
and the maintenance of the reliability of the IC in long-time operation.
In order to protect the IC from thermal destruction, it is necessary to operate the IC not in excess of the maximum junction
temperature Tjmax. Fig. 23 illustrates the power dissipation/heat mitigation characteristics for the TO252 package. Operate
the IC within the power dissipation Pd. The following method is used to calculate the power consumption PC (W).
PC=(VCC-VO)×IO+VCC×ICC
Power dissipation PdPC
Vcc : Input voltage
Vo : Output voltage
Io : Load current
Icc : Total supply current
The load current IO is obtained to operate the IC within the power dissipation.
Io
Pd-VCC×ICC
VCC-VO
(For more information about ICC, see page 12.)
The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process.
Calculation example
Example: BD3571FP VCC = 12 V and VO = 5 V at Ta = 85
IO0.624-12×ICC
12-5
θja=104.2/W-9.6mAW/
25=1.2W85=0.624W
IO89mA (ICC=30μA)
Make a thermal calculation in consideration of the above so that the whole operating temperature range will be within the
power dissipation.
The power consumption Pc of the IC in the event of shorting (i.e., if the VO and GND pins are shorted) will be obtained from
the following equation.
Pc=VCC×(ICC+Ishort)
Ishort = Short current
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
5/9
2011.03 - Rev.B
Free Datasheet http://www.datasheet4u.com/

5 Page





BD3574HFP arduino
Datasheet
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Free Datasheet http://www.datasheet4u.com/

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