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PDF TDA18214 Data sheet ( Hoja de datos )
| Número de pieza | TDA18214 | |
| Descripción | Silicon tuner | |
| Fabricantes | NXP Semiconductors | |
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TDA18214
Silicon tuner for digital terrestrial and cable TV reception
Rev. 1 — 13 July 2012
Preliminary short data sheet
1. General description
The TDA18214AHN and TDA18214HN are high performance silicon tuners designed for
digital terrestrial and digital cable TV reception.
The TDA18214AHN and TDA18214HN support all digital TV standards and deliver a Low
IF (LIF) signal to a demodulator.
The TDA18214AHN and TDA18214HN facilitate STB design by:
• Allowing on-board integration
• Drastically reducing the tuner Bill Of Material (BOM)
• Providing flexibility in system solution development
• Allowing straightforward, cost effective dual and multi-tuner applications optimization
In multi-tuner application, the TDA18214AHN is the master tuner whereas the
TDA18214HN is a slave tuner.
2. Features and benefits
Single 3.3 V supply voltage
Worldwide multistandard digital terrestrial and digital cable capabilities
Alignment free
RoHS compliant
I2C-bus interface compatible with 3.3 V microcontrollers
Crystal oscillator output buffer
Slave Tuner Output (STO) for multi-tuner applications (TDA18214AHN only)
Fully integrated oscillators
2 programmable General-Purpose Outputs (GPO)
Loop-Through Output (LTO)
1.7 MHz, 6 MHz, 7 MHz, 8 MHz and 10 MHz channel bandwidths
LIF channel center frequency output ranging from 0.8 MHz to 7.5 MHz
Fully integrated IF selectivity; eliminating the need for external SAW filters
Large flexibility in the IF filtering stage to ease the matching with various demodulators
circuits
Single-ended RF input, no need for external balun
Up to 1 GHz RF input capability
Excellent return loss compatible with cable requirements
Power Level Detector (PLD) embedded
Integrated gain control
Free Datasheet http://www.datasheet4u.com/
1 page  
NXP Semiconductors
TDA18214
Silicon tuner for digital terrestrial and cable TV reception
[1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design
of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction
temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I2C-bus. The
junction temperature: Tj = Tamb + Tj-c. where Tj-c = power Rth.
[2] Class III: 500 V to 1000 V.
7. Abbreviations
Table 4. Abbreviations
Acronym
Description
AGC
Automatic Gain Control
BOM
Bill Of Material
FCDM
Field-induced Charged-Device Model
GPO
General Purpose Outputs
H3H5
Harmonic 3 and Harmonic 5
HBM
Human Body Model
IF Intermediate Frequency
I/O Input/Output
LC-VCO
Inductors and Capacitors - Voltage Controlled Oscillator
LIF Low IF
LNA Low-Noise Amplifier
LO Local Oscillator
LTE Long-Term Evolution
LTO Loop-Through Output
PLD Power Level Detector
PLL Phase-Locked Loop
RF Radio Frequency
RoHS
Restriction of Hazardous Substances
SAW
Surface Acoustic Wave
STB Set-Top Box
STO
Slave Tuner Output
VCO
Voltage Controlled Oscillator
Xtal Crystal
WLAN
Wireless Local Area Network
8. Revision history
Table 5. Revision history
Document ID
Release date
TDA18214_SDS v.1
20120713
Data sheet status
Change notice
Preliminary short data sheet -
Supersedes
-
TDA18214_SDS
Preliminary short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1. — 13 July 2012
© NXP B.V. 2012. All rights reserved.
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