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PDF WS1103 Data sheet ( Hoja de datos )
| Número de pieza | WS1103 | |
| Descripción | CDMA Cell 3x3 Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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WS1103
CDMA Cell 3x3 Power Amplifier Module
(824-849 MHz)
Data Sheet
Description
The WS1103 is a CDMA(Code Division Multiple Access)
power amplifier module designed for handsets operat-
ing in the 824-849 MHz bandwidth.
The WS1103 features CoolPAM circuit technology that
offers state-of-the-art reliability, temperature stability
and ruggedness.
Digital mode control of CoolPAM reduces current
consumption, which enables extended talk time of
mobile devices.
The WS1103 meets stringent CDMA linearity
requirements to and beyond 28 dBm output power. The
3 mm x 3 mm form factor 8-pin surface mount package is
self contained, incorporating 50 ohm input and output
matching networks.
Functional Block Diagram
Features
• Excellent linearity
• Low quiescent current
• High efficiency
PAE at 28 dBm: 41.2%
PAE at 16 dBm: 17.7%
• 8-pin surface mounting package
3 mm x 3 mm x 1.0 mm
• Internal 50 ohm matching networks for both RF input
and output
• RoHS compliant
Applications
• Digital CDMA Cellular
• Wireless local loop
Order Information
Part Number
WS1103-TR1
WS1103-BLK
No. of Devices
1,000
100
Container
7”Tape and Reel
BULK
Vcc1 (1)
Vcc2 (8)
RF
INPUT
(2)
INPUT
MATCH
DA
INTER
STAGE
MATCH
PA
MMIC
BIAS CIRCUIT & CONTROL LOGIC
Vcont (3)
Vref (4)
OUTPUT
MATCH
MODULE
RF
OUTPUT
(7)
Free Datasheet http://www.datasheet4u.com/
1 page  
Evaluation Board Description
Vcc1
RF In
C4
4.7uF
Vcont
R1
0 ohm
Vref
1 Vcc1
2 RF In
C2
100pF
C3
100pF
3 Vcont
4 Vref
Figure 6. Evaluation board schematic
Vcc2 8
RF Out 7
GND 6
C1
330pF
Vcc2
C5
4.7uF
RF Out
GND 5
1103
PYYWW
AAAAA
Figure 7. Evaluation board assembly diagram
Free Datasheet http://www.datasheet4u.com/
5 Page 
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet
of neutralization or discharge will be sought. If the ac-
quired discharge route is through a semiconductor
device, destructive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling
in a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is
sensitive to damage induced by absorbed moisture and
temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three
consecutive simulated reflows.
The out of bag exposure time maximum limits are
determined by the classification test describe below
which corresponds to a MSL classification level 6 to 1
according to the JEDEC standard IPC/JEDEC J-STD-020B
and J-STD-033.
WS1103 is MSL3. Thus, according to the J-STD-033 p.11
the maximum Manufacturers Exposure Time (MET) for
this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature
for the WS1103 is targeted at 260°C +0/-5°C. Figure
19 and Table 7 show typical SMT profile for maximum
temperature of 260 +0/-5°C.
Table 5. ESD Classification
Pin # Name
1 Vcc1
2 RFIn
3 Vcont
4 Vref
5 GND
6 GND
7 RF Out
8 Vcc2
Description
Supply Voltage
RF Input
Control Voltage
Reference Voltage
Ground
Ground
RF Output
Supply Voltage
Note:
1. Module products should be considered extremely ESD sensitive.
HBM
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
CDM
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
Classification
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Table 6. Moisture Classification Level and Floor Life
MSL Level
1
2
2a
3
4
5
5a
6
Floor Life (out of bag) at factory ambient = < 30°C/60% RH or as stated
Unlimited at = < 30°C/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet WS1103.PDF ] | |
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