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PDF ACPM-5002-TR1 Data sheet ( Hoja de datos )

Número de pieza ACPM-5002-TR1
Descripción Power Amplifier Module
Fabricantes AVAGO 
Logotipo AVAGO Logotipo



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No Preview Available ! ACPM-5002-TR1 Hoja de datos, Descripción, Manual

ACPM-5002-TR1
Multimode PA - UMTS Band2, LTE Band25 and CDMA PCS
3x3mm Power Amplifier Module with Coupler
Data Sheet
Description
The ACPM-5002-TR1 is a fully matched 10-pin surface
mount module developed to support multimode ap-
plications including UMTS Band2 (1850-1910MHz)
and CDMA PCS band including BC14 (1850-1915MHz).
The ACPM-5002-TR1 meets stringent linearity require-
ments up to 28.6dBm output power for UMTS Rel.99 and
28.0dBm for CDMA. The 3mmx3mm form factor package
is self contained, incorporating 50ohm input and output
matching networks. The PA also contains internal DC
blocking capacitors for RF input and output ports.
The ACPM-5002-TR1 features 5th generation of CoolPAM
(CoolPAM5) circuit technology which supports 3 power
modes – active bypass, mid power and high power modes.
The CoolPAM is stage bypass technology enhancing
PAE (power added efficiency) at low and medium power
range. The active bypass feature is added to CoolPAM5 to
enhance the PAE further at low output range and it enables
the PA to have exceptionally low quiescent current. It
dramatically saves the average power consumption and
accordingly extends the talk time of mobiles and prolongs
a battery life.
A directional coupler is integrated into the module and
both coupling and isolation ports are available exter-
nally, supporting daisy chain. The integrated coupler
has excellent coupler directivity, which minimizes the
coupled output power variation or delivered power
variation caused by the load mismatch from the antenna.
The coupler directivity, or the output power variation into
the mismatched load, is critical to the TRP and SAR per-
formance of the mobile phones in real field operations as
well as compliance tests for the system specifications.
The ACPM-5002 has integrated on-chip Vref and on-module
bias switch as the one of the key features of the CoolPAM-5,
so an external constant voltage source is not required,
eliminating the external LDO regulators and switches
from circuit boards of mobile devices. It also makes the PA
fully digital-controllable by the Ven pin that simply turns
the PA on and off from the digital control logic input from
baseband chipsets. All of the digital control input pins
Features
Thin Package (0.9mm typ)
Excellent Linearity
3-mode power control with Vbp and Vmode
– Bypass / Mid Power Mode / High Power Mode
High Efficiency at max output power
10-pin surface mounting package
Internal 50ohm matching networks for both RF input
and output
Integrated coupler
– Coupler and Isolation ports for daisy chain
Lead-free, RoHS compliant, Green
Applications
UMTS Band2
LTE Band25
CDMA PCS(BC1) and BC14
Ordering Information
Part Number
ACPM-5002-TR1
ACPM-5002-BLK
Number
of Devices
1000
100
Container
178mm (7”) Tape/Reel
Bulk
Description (Cont.)
such as the Ven, Vmode and Vbp are fully CMOS com-
patible and can operate down to the 1.35V logic. The
current consumption by digital control pins is negligible.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness.
Free Datasheet http://www.datasheet4u.com/

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ACPM-5002-TR1 pdf
Package Dimensions
All dimensions ae in millimeter
Pin 1 Mark
1 10
29
38
47
56
3 ± 0.1
3 ± 0.1
0.5
0.9 ± 0.1
Marking Specification
Pin 1 Mark
A5002
PYYWW
QAAAAA
Manufacturing Part Number
Lot Number
P Manufacturing Info
YY Manufacturing Year
WW Work Week
QAAAAA Assembly Lot Number
5
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ACPM-5002-TR1 arduino
Reflow Profile Recommendations
Tp
TL
Tsmax
Tsmin
ts
Preheat
Ramp-up
tp
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25°C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (Tp)
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C/sec max
6 min max.
Pb-Free Solder
3°C/sec max
150°C
200°C
60-120 sec
3°C/sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C/sec max
8 min max.
11
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