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PDF FPF1208 Data sheet ( Hoja de datos )

Número de pieza FPF1208
Descripción (FPF1207 / FPF1208) IntelliMAX Advanced Load Switch
Fabricantes Fairchild Semiconductor 
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No Preview Available ! FPF1208 Hoja de datos, Descripción, Manual

October 2010
FPF1207 / FPF1208
IntelliMAXAdvanced Load Switch
Features
ƒ 1.2V to 4.0V Input Voltage Operating Range
ƒ Typical RON: 50mat VIN=3.3V
77mat VIN=1.8V
150mat VIN=1.2V
ƒ Slew Rate Control with tR: 110µs
ƒ Output Discharge Function on FPF1208
ƒ Low <1.5µA Quiescent Current
ƒ Extra Low <100nA Off Supply Current
ƒ ESD Protected: Above 7000V HBM, 2000V CDM
ƒ GPIO/CMOS-Compatible Enable Circuitry
ƒ 4-Bump WLCSP 0.76mm x 0.76mm, 0.4mm Pitch
Description
The FPF1207/08 is an ultra-small integrated IntelliMAX
load switch with integrated P-channel switch and analog
control features. Integrated slew-rate control prevents
inrush current and the resulting excessive voltage drop
on power rail. The input voltage range operates from
1.2V to 4.0V to provide power-disconnect capability for
post-regulated power rails in portable and consumer
products. The low shut-off current of 1µA (maximum)
allows power designs to meet standby and off-power
drain specifications.
The FPF1207/08 is controlled by an active-HIGH logic
input (ON pin) compatible with standard CMOS GPIO
circuitry found on Field Programmable Gate Array
(FPGA) and embedded processors. The FPF1207/08 is
available in 0.76mm x 0.76mm 4-bump WLCSP.
Applications
ƒ Mobile Devices and Smart Phones
ƒ Portable Media Devices
ƒ Ultra-Portable / Mobile Computing
ƒ Advanced Notebook, UMPC, MID
ƒ Portable Medical Devices
ƒ GPS and Navigation Equipment
http://www.DataSheet4U.com/
Ordering Information
Part Number
FPF1207UCX
Top
Marking
QG
Switch
(Typical)
at 3.3VIN
50m
FPF1208UCX
QH
50m
Output
Discharge
NA
65
ON Pin
Activity
tR
Package
Active
HIGH
Active
HIGH
110µs 4-Ball, Wafer-Level Chip-
Scale Package (WLCSP),
110µs 0.76 x 0.76mm, 0.4mm Pitch
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
www.fairchildsemi.com

1 page




FPF1208 pdf
Electrical Characteristics
Unless otherwise noted, VIN=1.2 to 4.0V and TA=-40 to +85°C. Typical values are at VIN=3.3V and TA=25°C.
Symbol
Parameter
Conditions
Min. Typ. Max. Units
Basic Operation
VIN Supply Voltage
1.2
IQ(OFF) Off Supply Current
VON=GND, VOUT=Open, VIN=4V
ISD(OFF) Off Switch Current
VON=GND, VOUT=GND
IQ Quiescent Current
IOUT=0mA
VIN=3.3V, IOUT=200mA, TA=25°C
50
RON On Resistance
VIN=1.8V, IOUT=200mA, TA=25°C
VIN=1.2V, IOUT=200mA, TA=25°C
77
150
VIN=1.8V, IOUT=200mA, TA=85°C
RPD
Output Discharge RPULL DOWN
VIN=3.3V, VON=0V, IFORCE=20mA,
TA=25°C, FPF1208
65
VIH
On Input Logic HIGH Voltage VIN <1.5V
VIN=1.5V to 4.0V
0.9
1.1
VIL On Input Logic LOW Voltage VIN=1.2V to 4.0V
ION On Input Leakage
Dynamic Characteristics(5)
VON=VIN or GND
tDON
tR
tON
tDOFF
tF
tOFF
Turn-On Delay(6)
VOUT Rise Time(6)
Turn-On Time(6)
Turn-Off Delay(6)
VOUT Fall Time(6)
Turn-Off Time(6)
VIN=3.3V, RL=10, CL=0.1µF,
TA=25°C
http://www.DataSheet4U.com/
VIN=3.3V, RL=10, CL=0.1µF,
TA=25°C, FPF1207
110
110
220
7
2
9
tDOFF
tF
tOFF
Turn-Off Delay
VOUT Fall Time
Turn-Off Time
VIN=3.3V, RL=10, CL=0.1µF,
TA=25°C, FPF1208
2.0
1.9
3.9
tDOFF
tF
tOFF
Turn-Off Delay
VOUT Fall Time
Turn-Off Time(6)
VIN=3.3V, RL=500, CL=0.1µF,
TA=25°C, FPF1207
10
95
105
tDOFF
tF
tOFF
Turn-Off Delay
VOUT Fall Time
Turn-Off Time(6)
VIN=3.3V,
TA=25°C,
FRPL=F5102008(,7)CL=0.1µF,
7.0
10.5
17.5
Notes:
5. These parameters are guaranteed by design and characterization; not production tested.
6. tDON/tDOFF/tR/tF are defined in Figure 25.
7. Output discharge path is enabled during device off.
4.0
100
1
1.5
66
91
160
100
110
0.75
1
V
nA
μA
μA
m
V
V
μA
μs
μs
μs
μs
μs
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
5
www.fairchildsemi.com

5 Page





FPF1208 arduino
Physical Dimensions
0.03 C
2X
E
F
A
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.539
0.461
E
0.40
A1
0.40
Ø0.20
Cu Pad
Ø0.30
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.292±0.018
0.208±0.021
C SEATING PLANE
D SIDE VIEWS
0.40
0.005 C A B
Ø0.260±0.020
4X
0.40
B (Y)±0.018
A
12
F
(X)±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
http://www.DataSheet4U.com/
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 27. 4 Ball, 0.76 x 0.76 mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
FPF1207UCX
FPF1208UCX
D
760µm ± 30µm
760µm ± 30µm
E
760µm ± 30µm
760um ± 30µm
X
0.180mm± 0.018µm
0.180mm± 0.018µm
Y
0.180mm± 0.018µm
0.180mm± 0.018µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawing: http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 • Rev. 1.0.0
11
www.fairchildsemi.com

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