PDF TCP-3068H Data sheet ( Hoja de datos )

Número de pieza	TCP-3068H
Descripción	Passive Tunable Integrated Circuits
Fabricantes	ON Semiconductor
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No Preview Available ! TCP-3068H Advance Information 6.8 pF Passive Tunable Integrated Circuits (PTIC) Introduction ON Semiconductor’s PTICs have excellent RF performance and power consumption, making them suitable for any mobile handset or radio application. The fundamental building block of our PTIC product line is a tunable material called ParaScant, based on Barium Strontium Titanate (BST). PTICs have the ability to change their capacitance from a supplied bias voltage generated by the Control IC. The 6.8 pF PTICs are available as wafer-level chip scale packages (WLCSP) and in QFN packages for easy mounting directly on printed circuit boards. Key Features • High Tuning Range and Operation up to 20 V • Usable Frequency Range: from 700 MHz to 2.7 GHz • High Quality Factor (Q) for Low Loss • High Power Handling Capability • Compatible with PTIC Control IC TCC-103 • WLCSP Package: 0.722 x 1.179 x 0.611 mm (12 pillar) • QFN Package: 1.200 x 1.600 x 0.950 mm • QFN: MSL−2 Moisture Sensitivity Level (per J−STD−020) http://www.DataSheet4U.net/ • Pb−Free and RoHS Compliant Typical Applications • Multi-band, Multi-standard, Advanced and Simple Mobile Phones • Tunable Antenna Matching Networks • Tunable RF Filters • Active Antennas http://onsemi.com WLCSP 12 pillar CASE TBD QFN 6 pin CASE TBD QFN MARKING DIAGRAM X.XH X.X = 6.8 H = High Tuning FUNCTIONAL BLOCK DIAGRAM PTIC RF1 RF2 Bias Figure 1. PTIC Functional Block Diagram This document contains information on a new product. Specifications and information herein are subject to change without notice. © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. P1 1 ORDERING INFORMATION Device Package Shipping TCP−3068H−DT WLCSP (Pb−Free) 4000 Units / 7” Reel TCP−3068H−QT QFN (Pb−Free) 8000 Units / 13” Reel For detailed ordering information, including part number definition and capacitance (pF) see the package dimensions section on page 7 of this datasheet. Publication Order Number: TCP−3068H/D datasheet pdf - http://www.DataSheet4U.net/ 1 page TCP−3068H Wafer Level Chip Scale Package (WLCSP) Layout and Dimensional Information A2 A1 D3 D2 (Copper Pillar Height) D1 C1 C2 C3 N/C Bias B3 RF1 RF2 RF1 RF2 B2 RF1 RF2 RF1 RF2 B2 RF1 RF2 2X 0.104 mm (Typ) (Copper Pillar) 2X 0.069 mm (Typ) (Copper Pillar) RF Pillars 0.104 mm (Typ) Top View (Pillars Down) Note: 2X means 2 sites with the specific value 3X means 3 sites with the specific value 4X means 4 sites with the specific value Side View B4 B1 Bottom View (Pillars Up) Figure 7. WLCSP Pin Markers and Dimensions RF Pillars 0.069 mm (Typ) Table 3. PACKAGE DIMENSIONS (All dimensions are in milimeters) WLCSP * DIM Nominal Max 8P A1 0.879 10P A1 1.029 12P A1 1.179 14P A1 1.329 ALL A2 0.722 ALL B1 0.460 ALL B2 0.150 ALL B3 0.300 ALL B4 0.130 ALL C1 0.148 ALL C2 0.425 ALL C3 0.130 ALL D1 0.530 ALL D2 0.081 *Total number of pillars Device 1.2, 2.7 pF 3.3, 3.9 pF 4.7, 5.6, 6.8, 8.2 pF http://www.DataSheet4U.net/ Note: 0.9 mm pad layout is standard for all products. Shorter pad layouts can be considered for smaller products. Figure 8. Recommended Pad Layout http://onsemi.com 5 datasheet pdf - http://www.DataSheet4U.net/ 5 Page

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Número de pieza	Descripción	Fabricantes
TCP-3068H	Passive Tunable Integrated Circuits	ON Semiconductor

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