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PDF 2N7002 Data sheet ( Hoja de datos )
| Número de pieza | 2N7002 | |
| Descripción | N-channel Trench MOSFET | |
| Fabricantes | NXP Semiconductors | |
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2N7002
60 V, 300 mA N-channel Trench MOSFET
Rev. 7 — 8 September 2011
Product data sheet
1. Product profile
1.1 General description
N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using
Trench MOSFET technology.
1.2 Features and benefits
Suitable for logic level gate drive
sources
Very fast switching
Surface-mounted package
Trench MOSFET technology
1.3 Applications
Logic level translators
High-speed line drivers
1.4 Quick reference data
Table 1.
Symbol
VDS
ID
Quick reference data
Parameter
drain-source voltage
drain current
Ptot total power dissipation
Static characteristics
RDSon
drain-source on-state
resistance
Conditions
25 °C ≤ Tj ≤ 150 °C
VGS = 10 V; Tsp = 25 °C; see Figure 1;
see Figure 3
Tsp = 25 °C; see Figure 2
VGS = 10 V; ID = 500 mA; Tj = 25 °C;
see Figure 6; see Figure 8
2. Pinning information
Min Typ Max Unit
- - 60 V
- - 300 mA
- - 0.83 W
-
2.8 5
Ω
Table 2.
Pin
1
2
3
Pinning information
Symbol Description
G gate
S source
D drain
Simplified outline
3
12
SOT23 (TO-236AB)
Graphic symbol
D
G
mbb076 S
1 page  
NXP Semiconductors
2N7002
60 V, 300 mA N-channel Trench MOSFET
7. Characteristics
Table 7. Characteristics
Symbol
Parameter
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
VGSth
gate-source threshold
voltage
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
Dynamic characteristics
Ciss input capacitance
Coss output capacitance
Crss reverse transfer
capacitance
ton turn-on time
toff turn-off time
Source-drain diode
VSD source-drain voltage
Qr recovered charge
trr reverse recovery time
Conditions
ID = 10 µA; VGS = 0 V; Tj = 25 °C
ID = 10 µA; VGS = 0 V; Tj = -55 °C
ID = 0.25 mA; VDS = VGS; Tj = 25 °C;
see Figure 9; see Figure 10
ID = 0.25 mA; VDS = VGS; Tj = 150 °C;
see Figure 9; see Figure 10
ID = 0.25 mA; VDS = VGS; Tj = -55 °C;
see Figure 9; see Figure 10
VDS = 48 V; VGS = 0 V; Tj = 25 °C
VDS = 48 V; VGS = 0 V; Tj = 150 °C
VGS = 15 V; VDS = 0 V; Tj = 25 °C
VGS = -15 V; VDS = 0 V; Tj = 25 °C
VGS = 10 V; ID = 500 mA; Tj = 25 °C;
see Figure 6; see Figure 8
VGS = 10 V; ID = 500 mA; Tj = 150 °C;
see Figure 6; see Figure 8
VGS = 4.5 V; ID = 75 mA; Tj = 25 °C; see
Figure 6; see Figure 8
VDS = 10 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C
VGS = 10 V; VDS = 50 V; RL = 250 Ω;
RG(ext) = 50 Ω; RGS = 50 Ω
IS = 300 mA; VGS = 0 V; Tj = 25 °C; see
Figure 11
VGS = 0 V; IS = 300 mA;
dIS/dt = -100 A/µs
Min Typ Max Unit
60 -
55 -
12
-V
-V
2.5 V
0.6 - - V
- - 2.75 V
-
0.01 1
µA
- - 10 µA
- 10 100 nA
- 10 100 nA
-
2.8 5
Ω
- - 9.25 Ω
- 3.8 5.3 Ω
- 31 50 pF
- 6.8 30 pF
- 3.5 10 pF
- 2.5 10 ns
- 11 15 ns
- 0.85 1.5 V
- 30 - nC
- 30 - ns
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 13
5 Page 
NXP Semiconductors
2N7002
60 V, 300 mA N-channel Trench MOSFET
11. Legal information
11.1 Data sheet status
Document status [1] [2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status [3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
2N7002
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 8 September 2011
© NXP B.V. 2011. All rights reserved.
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