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Número de pieza M4200C-xxxxAHxxT
Descripción COLOR MONITOR SERVICE MANUAL
Fabricantes LG 
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Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CL-70
MODEL:
M4200C (M4200C-SAC.AH**T)
M4200C (M4200C-SAFC.AH**T)
M4200C (M4200C-BAC.AH**T)
M4200C (M4200C-BATC.AH**T)
M4200C (M4200C-BAPC.AH**T)
CAUTION
( ) **Same model for Service
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
http://www.DataSheet4U.net/
datasheet pdf - http://www.DataSheet4U.net/

1 page




M4200C-xxxxAHxxT pdf
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-http://www.DataSheet4U.net/
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
-5-
datasheet pdf - http://www.DataSheet4U.net/

5 Page





M4200C-xxxxAHxxT arduino
DESCRIPTION OF BLOCK DIAGRAM
1. INPUT SELECTION CIRCUIT
1) D-SUB RGB INPUT SELECT : This section is
composed of Signal selector IC(BA7657F_U121)
and peripheral devices.
The BA7657F(U121) IC select RGB1 signal or
RGB2 signal and the signal is sent to gm1501H
(U402).
2) VIDEO INPUT SELECT : This section is composed of
Video switching IC(CXA2040AQ_U201) and peripheral
devices.
Video switching IC(CXA2040AQ_U201) select CVBS
video or S-video and the signal is sent to Video
decoder (UPD64012)
3) DVI signal input is directly fed to SCALER,
DTV(Component1) signal input is given to Scaler
IC(U402) via MST9883C(U303).
DVD(Component2) signal input is given to Scaler
IC via Video Decoder IC(UPD64012_U801).
2. DDC COTROLLER
This section is composed gm1501H(U402),EEPROM
IC (U404, U115, U120) and peripheral devices.
gm1501H(U402) is controlling peripheral devices through
IIC Line.
Major functions of this block are :
(1) Controlling of u-COM and Flash memory through
DDC-SCLA, DDC-SDAA of D-sub connector.
(2) Storage of EDID DATA in the EEPROM(U115, U120).
3. ANALOG DIGITAL CONVERTER
This section is composed of MST9883C(U303) and
peripheral devices.
gm1501H(U402) is controlling MST9883C through IIC
Line.
This IC is converting DTV(YPbPr) signal in to 16 bit
Interlace signal and the signal is sent to De-interlace
IC(MDIN150L_U901)
This output signal have CONTRAST, BRIHTNESS,
SHARPNESS, COLOR, TINT information.
3. VIDEO DECODER
This section is composed of UPD64012(U801) and
peripheral devices.
gm1501H(U402) is controlling UPD64012 through IIC Line.
This IC is controlling CVBS input signal, S-VIDEO(Y/C)
input signal and DVD(YCbCr) input signal.
and converting input signals in to 16 bit interlace signal
and the signal is sent to De-interlace IC(U901).
This output signal have CONTRAST, BRIHTNESS,
SHARPNESS, COLOR, TINT information.
4. DE-INTERLACER
This section is composed of MDIN150L(U901) and
peripheral devices.
gm1501H(U402) is controlling MDIN150L through IIC Line.
This IC is converting 16bit interlace input signal in to 16bit
De-interlace signal and the signal is sent to Video Signal
Processor IC(gm1501H_U402).Ä
5. AUDIO DECODER
This section is composed of MSP3420G(U501) and
peripheral devices.
gm1501H(U402) is controlling MSP3420G through IIC
Line.
This IC is processing audio signal output of A/V Jack,
PC Audio Jack.
This IC's output signal is sent to Audio Amplifier IC
(TPA3004_U502).
6. AUDIO AMPLIFIER
This section is composed of TPA3004(U502) OR
TPA3001(U507) and peripheral devices.
Audio Amplifier's function is amplification of sound signal
received from Audio Decoder.
Input Audio signal is amplified according to the DC
Volume control curve.
7. VIDEO SIGNAL PROCESSOR (FORMAT CONVERTER)
This section is composed of gm1501H(U402) and
peripheral devices.
gm1501H(SCALER_U402) have in built u-COM in IC.
(1) This IC include A/D Converter, Pre-Amp, PLL Circuit.
(2) This IC include TMDS Receiver and LVDS Transmitter.
TMDS Receiver is decoding input DVI Signal and LVDS
Transmitter is encoding the output Signal .
also, gm1501H have Format Converter (Scaling) function.
This IC convert Various sized Digital signal to LCD
Module's resolution (WXGA).
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8. DC/DC COVERTER
DC/DC Converters change Power output voltage (DC
5V, 12V, 24V) to 1.5V, 2.5V, 3.3V, 5V, 8V, 9V.
(To be used by different IC on the main board.)
9. TEMPERATURE SENSING AND FAN CONTROL
This section is composed of LM35DT(U523),
KIA358F(U524) and peripheral devices.
The temperature at surface of LM35DT(U523) is sensed
and converted to HEX code by KIA358(U524).
gm1501H(U402) receives sensing HEX values from
KIA358F(U524)and control FAN(42INCH ONLY).
10. POWER SUPPLY BLOCK
Power supply receives AC voltage (100-240 V, 50/60
Hz,) and converts to System voltage that are 5V, 12V,
18V and 24V DC voltage.
These voltages supports main board, inverter board
and module;s T-con board.
This Circuit contains PFC(Power Factor Correction)
circuit.
The Minimum Power efficiency is about 75%.
- 11 -
datasheet pdf - http://www.DataSheet4U.net/

11 Page







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