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PDF QTH-060-02-F-D-A Data sheet ( Hoja de datos )

Número de pieza QTH-060-02-F-D-A
Descripción HIGH SPEED GROUND PLANE HEADER
Fabricantes Samtec 
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No Preview Available ! QTH-060-02-F-D-A Hoja de datos, Descripción, Manual

F-212
QTH–090–01–C–D–A
®
(0,50mm) .0197"
QTH SERIES
QTH–060–07–F–D–A
QTH–030–01–L–D–A–RT1
HIGH SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and
30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Mates:
QSH
Integral metal plane for
power or ground
Cable Mates:
HFHM2, HQCD, HQDP
(See Application Specific note)
TM
Standard Stack Heights
from 5mm to 25mm
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSH
QTH/QSH
5mm Stack Height
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling
–D 9 GHz / 18 Gbps 11 GHz / 22 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling –DP 9.5 GHz / 19 Gbps
––––
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact [email protected]
Polarized
ALSO
AVAILABLE
Board Spacing Standoffs.
See SO Series.
QTH
PINS PER ROW
NO. OF PAIRS
www.DataSheet.net/
LEAD
STYLE
PLATING
OPTION
TYPE
®
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A
OTHER
OPTION
–030, –060, –090, –120
(60 total pins per bank = –D)
–020, –040, –060, –080
(20 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
(7,11)
.280
02
(0,50)
.0197
A
–01 & –02
(0,20)
.008
(0,76) (3,30) .130
.030
–03 thru –07
(1,57)
.062
–C*
= Electro-Polished
Selective
50µ" (1,27µm) min Au
over 150µ" (3,81µm)
Ni on Signal Pins
in contact area,
A
10µ" (0,25µm) min Au
over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1,27µm) min Ni
on all solder tails
(0,89)
.035
DIA
(1,57)
.062
DIA –RT1
(0,64)
.025
–L
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–K
= (7,00mm)
.275" DIA
Polyimide film
Pick &
Place Pad
(N/A with -05 &
-07 lead style)
– TR
= Tape & Reel
(–090 positions
maximum)
QTH
HEIGHT
LEAD A WITH
STYLE
QSH*
–01
(4,27) (5,00)
.168 .197
–02
(7,26)
.286
(8,00)
.315
–03
(10,27) (11,00)
.404 .433
–04
(15,25) (16,00)
.600 .630
–05
(18,26) (19,00)
.718 .748
–07
(24,24) (25,00)
.954 .984
*Processing conditions
will affect mated height.
– RT1
= Retention
Option
(–01 lead style
only & –090
positions
maximum)
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP),
–080, –090
& –120 or
–RT1 option)
WWW.SAMTEC.COM
Datasheet pdf - http://www.DataSheet4U.co.kr/

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