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PDF TGC4406-SM Data sheet ( Hoja de datos )
| Número de pieza | TGC4406-SM | |
| Descripción | 28 - 34 GHz Packaged Doubler with Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
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TGC4406-SM
14 - 17 GHz Packaged Doubler with Amplifier
Key Features
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RF Output Frequency Range: 28 - 34 GHz
Input Frequency Range: 14 - 17 GHz
Output Power: 20 dBm Nominal
Conversion Gain: 15 dB Nominal
Input Frequency Isolation: 25 dBc
Bias: Vd = 5 V, Id = 150 mA, Vg = -0.5 V
•
Typical, Vdbl = -0.8 V Fixed,
Package Dimensions: 4 x 4 x 0.9 mm
Measured Performance
Bias conditions: Vd = 5 V, Id = 150 mA, Vg = -0.5 V
Typical, Vdbl = -0.8 V Fixed
Primary Applications
• Point-to-Point Radio
• Ka Band Satcom
Product Descriptionwww.DataSheet.net/
The TriQuint TGC4406-SM packaged MMIC
combines a frequency doubler operating at input
frequencies of 14 - 17 GHz, with a 3-stage output
amplifier. The TGC4406-SM achieves typically 25
dBc input frequency isolation and 20 dBm output
power with 5 dBm input power. This performance
makes this doubler ideally suited for Point to Point
Radios and Ka-Band satellite ground terminal
applications. The TGC4406-SM provides the
frequency doubling function in an compact 4 mm x
4 mm package footprint.
Each device is 100% DC and RF tested on–wafer
to ensure performance compliance.
Evaluation boards are available upon request.
Lead-free and RoHS compliant.
Datasheet subject to change without notice.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
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Measured Data
TGC4406-SM
Bias conditions: Vd = 5 V, Id = 150 mA, Vg = -0.5 V Typical, Vdbl = -0.8 V Fixed
www.DataSheet.net/
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
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TGC4406-SM
Assembly Notes
Recommended Surface Mount Package Assembly
• Proper ESD precautions must be followed while handling packages.
• Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
• TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
• Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
• Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3 °C/sec
3 °C/sec
Activation Time and Temperature
60 – 120 sec @ 140 – 160 °C
60 – 180 sec @ 150 – 200 °C
Time above Melting Point
Max Peak Temperature
60 – 150 sec
www.DataSheet.net/
240 °C
60 – 150 sec
260 °C
Time within 5 °C of Peak Temperature
10 – 20 sec
10 – 20 sec
Ramp-down Rate
4 – 6 °C/sec
4 – 6 °C/sec
Environmental Ratings
Moisture Sensitivity Rating
1
Ordering Information
Part
TGC4406-SM
ECCN
3A001b.2.d
Package Style
QFN 4x4 Surface Mount
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
11
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Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGC4406-SM.PDF ] | |
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