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Número de pieza | TGC4405 | |
Descripción | 17 - 27 GHz Upconverter | |
Fabricantes | TriQuint Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de TGC4405 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
No Preview Available ! 17 - 27 GHz Upconverter
TGC4405
Key Features
•••••••••
RF Output Frequency Range: 17 - 27 GHz
LO Input Frequency Range: 8 -13 GHz
IF Input Frequency Range: 0.5 - 3 GHz
13 dB Conversion Gain
28 dBm OTOI
30 dBc LO Isolation
Bias: Vd = 5 V, Idq = 425 mA, Vg = -0.5 V Typical
Technology: 3MI 0.25 um Power PHEMT
Chip Dimensions: 2.07 x 1.93 x 0.1mm
Measured Performance
Primary Applications
Vd = 5V, Idq = 425mA, Vmxr = Vdbl = -0.9V
IF = 2GHz @ -8dBm, +2dBm LO
20
18
16
14
12
10
8
6
4 Upper Side Band
2 Lower Side Band
0
•
•
Point-to-Point Radio
Ku Band Sat-Com
Product Description
www.DataSheet.net/
The TriQuint TGC4405 is a multifunction chip. It is an
upconverter with RF output frequencies of 17 to 27
GHz. It contains a frequency doubler and local
oscillator (LO) amplifier, operating at LO Input
frequencies of 8 - 13 GHz. The part is designed using
TriQuint’s 0.25 um 3MI power pHEMT process.
17 18 19 20 21 22 23 24 25 26 27
RF Output Frequency (GHz)
Vd = 5V, Idq = 425mA, Vmxr = Vdbl = -0.9V
IF = 2GHz +/- 5MHz @ -8dBm Input/Tone, +2dBm LO
34
32
30
28
26
24
22
20
18
16
14
The TGC4405 nominally provides 13 dB Conversion
Gain and 28 dBm OTOI when operated with LO inputs
from 2 - 5 dBm. The part also achieves 30 dBc typical
isolation between the fundamental and doubled
frequency.
The TGC4405 is ideally suited for low cost markets
such as Point-to-Point Radio, and Ku-band Satellite
Communications.
The TGC4405 is 100% DC and RF tested on-wafer to
ensure performance compliance.
The TGC4405 has a protective surface passivation
layer providing environmental robustness.
Lead-Free & RoHS compliant
18 19 20 21 22 23 24 25 26 27 28
RF Output Frequency (GHz)
Datasheet subject to change without notice.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
1
Oct 2006 © Rev -
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page Measured Data
TGC4405
Vd = 5V, Idq = 425mA, Vmxr = Vdbl = -0.9V
IF = 2GHz @ -8dBm, +2dBm LO
20
18
16
14
12
10
8
6
4
2
0
-2
-4
-6 Upper Side Band
-8 Lower Side Band
-10
14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
RF Output Frequency (GHz)
www.DataSheet.net/
Vd = 5V, Idq = 425mA, Vmxr = Vdbl = -0.9V
IF = 2GHz +/- 5MHz @ -8dBm Input/Tone, +2dBm LO
34
32
30
28
26
24
22
20
18
16
14
12
10
8
Upper Side Band
6 Lower Side Band
4
14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
RF Output Frequency (GHz)
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Oct 2006 © Rev -
5
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page TGC4405
Assembly Notes
Component placement and adhesive attachment assembly notes:
1. Vacuum pencils and/or vacuum collets are the preferred method of pick up.
2. Air bridges must be avoided during placement.
3. The force impact is critical during auto placement.
4. Organic attachment (i.e. epoxy) can be used in low-power applications.
5. Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
1. Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
2. An alloy station or conveyor furnace with reducing atmosphere should be used.
3. Do not use any kind of flux.
4. Coefficient of thermal expansion matching is critical for long-term reliability.
5. Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
1. Thermosonic ball bonding is the preferred interconnectwww.DataSheet.net/ technique.
2. Force, time, and ultrasonics are critical parameters.
3. Aluminum wire should not be used.
4. Devices with small pad sizes should be bonded with 0.0007-inch wire.
Ordering Information
Part
TGC4405
Package Style
GaAs MMIC Die
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Oct 2006 © Rev -
11
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet TGC4405.PDF ] |
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