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PDF TGL2201 Data sheet ( Hoja de datos )
| Número de pieza | TGL2201 | |
| Descripción | Wideband VPIN Limiter | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TGL2201 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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Wideband Dual Stage VPIN Limiter
Product Data Sheet
November 15, 2006
TGL2201
Key Features
• 3-25 GHz Passive, High Isolation Limiter
• Low Loss < 0.5 dB , X-band
• Good Return Loss > 15 dB
• Flat Leakage < 18 dBm
• Input Power CW Survivability > 5W
• Integrated DC Block on both input and output
• Chip Dimensions: 1.1 x 1.1 x 0.1 mm
Primary Applications
• Military Radar
• LNA Receiver Chain Protection
Fixtured Measured Performance
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
0
26
24
22
20
18
16
14
12
10
8
9
0
-3
-6
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-9
-12
-15
-18
-21
-24
3 6 9 12 15 18 21 24 27 30
Frequency (GHz)
Data taken @ 10 GHz
12 15 18 21 24 27 30 33 36
Input Power (dBm)
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
1
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
Assembly Process Notes
Product Data Sheet
November 15, 2006
TGL2201
Reflow process assembly notes:
� Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 �C for 30 sec
� An alloy station or conveyor furnace with reducing atmosphere should be used.
� No fluxes should be utilized.
� Coefficient of thermal expansion matching is critical for long-term reliability.
� Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
� Vacuum pencils and/or vacuum collets are the preferred method of pick up.
� Air bridges must be avoided during placement.
� The force impact is critical during auto placement.
� Organic attachment can be used in low-power applications.
� Curing should be done in a convection oven; proper exhaust is a safety concern.
� Microwave or radiant curing should not be used because of differential heating.
� Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
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� Thermosonic ball bonding is the preferred interconnect technique.
� Force, time, and ultrasonics are critical parameters.
� Aluminum wire should not be used.
� Maximum stage temperature is 200 �C.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
5
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet TGL2201.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| TGL2201 | Wideband VPIN Limiter | TriQuint Semiconductor |
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