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PDF TGA2535-SM Data sheet ( Hoja de datos )

Número de pieza TGA2535-SM
Descripción X-Band Power Amplifier
Fabricantes TriQuint Semiconductor 
Logotipo TriQuint Semiconductor Logotipo



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No Preview Available ! TGA2535-SM Hoja de datos, Descripción, Manual

TGA2535-SM
X-Band Power Amplifier
Applications
Point-to-Point Radio
X-Band Communications
Product Features
Frequency Range: 10 – 12 GHz
TOI: 43 dBm
Power: 34.5 dBm Psat, 33 dBm P1dB
Gain: 24 dB
Return Loss: 15 dB
Integrated Power Detector
Bias: Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical
Package Dimensions: 5.0 x 5.0 x 0.85 mm
QFN 5x5mm 24L
Functional Block Diagram
24 23 22 21 20 19
1 18
2 17
3 16
4 15
5 14
6 13
General Description
The TriQuint TGA2535-SM is a X-Band Packaged
Power Amplifier. The TGA2535-SM operates from 10
to 12 GHz and is designed using TriQuint’s power
pHEMT production process.
The TGA2535-SM typically provides 43dBm of TOI at
20dBm Pout/Tone, 33 dBm of output power at 1dB gain
compression, and the small signal gain is 24 dB.
The TGA2535-SM is available in a low-cost, surface
mount 24 lead 5x5 QFN package and is ideally suited for
Point-to-Point Radio, and X-Band Communications.
Lead-free and RoHS compliant
Evaluation Boards are available upon request.
www.DataSheet.net/
7 8 9 10 11 12
Pin Configuration
Pin #
1, 2, 3, 5, 6, 9, 12, 13, 14,
15, 17
4
7, 8, 23, 24
16
10, 11, 20, 21
18
19
22
Symbol
N/C
RF IN
Vg
RF OUT
Vd
Vref
Vdet
GND
Ordering Information
Data Sheet: Rev A 10/25/11
© 2011 TriQuint Semiconductor, Inc.
Part No.
ECCN
Description
TGA2535-SM 3A001.b.2.b X-band Power Amplifier
Standard T/R size = 500 pieces on a 7” reel.
- 1 of 13 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/

1 page




TGA2535-SM pdf
TGA2535-SM
X-Band Power Amplifier
Typical Performance (cont.)
TOI vs. Frequency vs. Pout/Tone
Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C
46
45
44
43
42
41 Pout/Tone = 21dBm
40 Pout/Tone = 20dBm
39 Pout/Tone = 19dBm
38
37
36
9.5 10 10.5 11 11.5 12 12.5
Frequency (GHz)
IM3 vs. Pout/Tone vs. Frequency
Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C
-30
-35
-40
-45
-50
-55 10.0GHz
-60 11.0GHz
-65 11.7GHz
12.0GHz
-70
13 14 15 16 17 18 19 20 21 22 23
Pout/Tone (dBm)
IM5 vs. Pout/Tone vs. Frequency
Vd = 6 V, Id = 1.3 A, Vg = -0.55 V Typical, +25 0C
-50
-55
-60
-65
-70
-75 10.0GHz
-80 11.0GHz
-85 11.7GHz
12.0GHz
-90
13 14 15 16 17 18 19 20 21 22 23
Pout/Tone (dBm)
Gain vs. Frequency vs. Id
Vd = 6 - 6.5 V, Id = 0.9 - 1.3 A, +25 0C
28
26
24
22
www.DataSheet.net/
20
18
16
6V 1.3A
6V 1.1A
6V 0.9A
6.5V 1.0A
14
9
9.5 10 10.5 11 11.5 12 12.5 13
Frequency (GHz)
Saturated Power vs. Frequency vs. Id
Vd = 6 - 6.5 V, Id = 0.9 - 1.3 A, +25 0C
36
35
34
33 6V 1.3A
32 6V 1.1A
31 6V 0.9A
6.5V 1.0A
30
29
9.5
10 10.5 11 11.5 12 12.5
Frequency (GHz)
36
35
34
33
32
31
30
29
9.5
P1dB vs. Frequency vs. Id
Vd = 6 - 6.5 V, Id = 0.9 - 1.3 A, +25 0C
6V 1.3A
6V 1.1A
6V 0.9A
6.5V 1.0A
10 10.5 11 11.5 12 12.5
Frequency (GHz)
Data Sheet: Rev A 10/25/11
© 2011 TriQuint Semiconductor, Inc.
- 5 of 13 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/

5 Page





TGA2535-SM arduino
TGA2535-SM
X-Band Power Amplifier
Mechanical Information (cont.)
Mounting Configuration
All dimensions are in millimeters (inches).
Notes:
1. A heatsink underneath the area of the PCB for the mounted device is
recommended for proper thermal operation.
2. Ground / thermal vias are critical for the proper performance of this device.
Vias have a final plated thru diameter of .40 mm (.016”).
.675
.675
Tape and Reel Information
Tape and reel specifications for this part are also available on the TriQuint website in the “Application Notes” section.
Standard T/R size = 500 pieces on a 7” x 0.5” reel.
www.DataSheet.net/
CARRIER AND COVER TAPE DIMENSIONS
Part
Cavity
Distance Between Centerline
Cover Tape
Carrier Tape
Feature
Length
Width
Depth
Pitch
Cavity to Perforation
Length Direction
Cavity to Perforation
Width Direction
Width
Width
Symbol
A0
B0
K0
P1
P2
F
C
W
Size (in)
0.207
0.207
0.043
0.315
0.079
0.217
0.374
0.472
Size (mm)
5.25
5.25
1.10
8.00
2.00
5.50
9.5
12.0
Data Sheet: Rev A 10/25/11
© 2011 TriQuint Semiconductor, Inc.
- 11 of 13 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
Datasheet pdf - http://www.DataSheet4U.co.kr/

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