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Número de pieza | TGA2508-SCC | |
Descripción | 12-19 GHz VSAT Amplifier | |
Fabricantes | TriQuint Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de TGA2508-SCC (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
No Preview Available ! Product Data Sheet
January 1, 2007
12-19 GHz VSAT Amplifier
TGA2508-SCC
Key Features
• Frequency Range: 12 - 19 GHz
• 30 dB Nominal Gain
• 30 dBm Nominal P1dB @ 15 GHz
• 32 dBm Nominal OTOI
• Bias Conditions: 7 V, 433 mA
• 0.50 um 3MI pHEMT Technology
• Chip Dimensions: 2.1 x 1.1 x 0.1 mm
(0.083 x 0.118 x 0.004 in)
Product Description
The TriQuint TGA2508 is a compact Medium
Power Amplifier MMIC for VSAT applications. The
part is designed using TriQuint’s 0.5 um power
pHEMT production process.
The TGA2508 provides a nominal 30 dB Gain
from 12-19 GHz, with Output Power @ 1dB Gain
compression of 30 dBm. The MMIC also provides
32 dBm Output TOI @ Pin/Tone = -10 dBm.
The part is ideally suited for low cost emerging
markets such as VSAT Ground Terminals, Point-
to-Point Radio, Military Ku Band applications.
The TGA2508 is 100% DC and RF tested on-
wafer to ensure performance compliance.
Evaluation boards are available.
Primary Applications
• VSAT Ground Terminals
• Point to Point Radio
• Military Ku Band
Measured Data
Bias Conditions: Vd = 7 V, Id = 433 mA
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35
25
Gain
15
5
-5 ORL
-15 IRL
-25
12 13 14 15 16 17 18 19
Frequency (GHz)
32
31 P2dB
30
29
28 P1dB
27
26
25
12 13 14 15 16 17 18 19
Frequency (GHz)
1
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page Product Data Sheet
January 1, 2007
Measured Data
TGA2508-SCC
Bias Conditions: Vd = 7 V, Id = 433 mA
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
10 11 12 13 14 15 16 17 18 19 20
Fre que ncy (GHz)www.DataSheet.net/
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
10 11 12 13 14 15 16 17 18 19 20
Frequency (GHz)
5
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page Product Data Sheet
January 1, 2007
TGA2508-SCC
Assembly Process Notes
Reflow process assembly notes:
• Use AuSn (80/20) solder with limited exposure to temperatures at or above 3000C (30 seconds max).
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• No fluxes should be utilized.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
• Microwave or radiant curing should not be used because of differential heating.
• Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Maximum stage temperature is 2000C.
www.DataSheet.net/
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
11
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet TGA2508-SCC.PDF ] |
Número de pieza | Descripción | Fabricantes |
TGA2508-SCC | 12-19 GHz VSAT Amplifier | TriQuint Semiconductor |
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