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PDF TGA2508-SCC Data sheet ( Hoja de datos )

Número de pieza TGA2508-SCC
Descripción 12-19 GHz VSAT Amplifier
Fabricantes TriQuint Semiconductor 
Logotipo TriQuint Semiconductor Logotipo



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No Preview Available ! TGA2508-SCC Hoja de datos, Descripción, Manual

Product Data Sheet
January 1, 2007
12-19 GHz VSAT Amplifier
TGA2508-SCC
Key Features
Frequency Range: 12 - 19 GHz
30 dB Nominal Gain
30 dBm Nominal P1dB @ 15 GHz
32 dBm Nominal OTOI
Bias Conditions: 7 V, 433 mA
0.50 um 3MI pHEMT Technology
Chip Dimensions: 2.1 x 1.1 x 0.1 mm
(0.083 x 0.118 x 0.004 in)
Product Description
The TriQuint TGA2508 is a compact Medium
Power Amplifier MMIC for VSAT applications. The
part is designed using TriQuint’s 0.5 um power
pHEMT production process.
The TGA2508 provides a nominal 30 dB Gain
from 12-19 GHz, with Output Power @ 1dB Gain
compression of 30 dBm. The MMIC also provides
32 dBm Output TOI @ Pin/Tone = -10 dBm.
The part is ideally suited for low cost emerging
markets such as VSAT Ground Terminals, Point-
to-Point Radio, Military Ku Band applications.
The TGA2508 is 100% DC and RF tested on-
wafer to ensure performance compliance.
Evaluation boards are available.
Primary Applications
VSAT Ground Terminals
Point to Point Radio
Military Ku Band
Measured Data
Bias Conditions: Vd = 7 V, Id = 433 mA
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35
25
Gain
15
5
-5 ORL
-15 IRL
-25
12 13 14 15 16 17 18 19
Frequency (GHz)
32
31 P2dB
30
29
28 P1dB
27
26
25
12 13 14 15 16 17 18 19
Frequency (GHz)
1
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/

1 page




TGA2508-SCC pdf
Product Data Sheet
January 1, 2007
Measured Data
TGA2508-SCC
Bias Conditions: Vd = 7 V, Id = 433 mA
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
10 11 12 13 14 15 16 17 18 19 20
Fre que ncy (GHz)www.DataSheet.net/
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
10 11 12 13 14 15 16 17 18 19 20
Frequency (GHz)
5
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/

5 Page





TGA2508-SCC arduino
Product Data Sheet
January 1, 2007
TGA2508-SCC
Assembly Process Notes
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 3000C (30 seconds max).
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 2000C.
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GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
11
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/

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