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PDF TGA2507-SM Data sheet ( Hoja de datos )
| Número de pieza | TGA2507-SM | |
| Descripción | Ku-Band 3-Stage Driver Packaged Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TGA2507-SM (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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Ku-Band 3-Stage Driver Packaged Amplifier TGA2507-SM
Top View
Bottom View
Key Features
• 11-17 GHz Bandwidth
• 25 dB Nominal Gain
• 17 dBm Norminal P1dB
• Bias: 5 - 7 V, 75 mA Self Bias
• PHEMT Technology
• Package Dimensions:
4.0 x 4.0 x 0.9 mm
(0.157 x 0.157 x 0.035 in)
Measured Data
Primary Applications
• Point to Point Radio
• Military Ku-Band
• Ku-Band Space
• VSAT
• Lead-Free & RoHS compliant
• Demo boards are available.
Bias Conditions: Vd = 6 V, Id = 75 mA Self Bias
30
20 GAIN
10
0 ORL
-10
-20
www.DataSheet.net/
IRL
-30
-40
11 12 13 14 15 16 17 18
Frequency (GHz)
19
22
21
20 Psat
19
18
17 P1dB
16
15
14
13
11 12 13 14 15 16 17 18
Frequency (GHz)
Datasheet subject to change without notice.
1
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
April 2012 © Rev B
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
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Measured Data
TGA2507-SM
Bias Conditions: Vd = 5-7 V, Id =75 mA Self Bias
7V
6V
5V
12 13 14 15 16 17 18
Frequency (GHz)
www.DataSheet.net/
7V
6V
5V
12 13 14 15 16 17 18
Frequency (GHz)
5
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
April 2012 © Rev B
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page 
TGA2507-SM
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak
Temperature
Ramp-down Rate
SnPb
3 °C/sec
www.DataSheet.net/
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
11
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
April 2012 © Rev B
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGA2507-SM.PDF ] | |
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