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Número de pieza | TGA2506 | |
Descripción | 12-18 GHz Ku-Band 2-Stage Driver Amplifier | |
Fabricantes | TriQuint Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de TGA2506 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
No Preview Available ! Product Data Sheet
August 5, 2008
12-18 GHz Ku-Band 2-Stage Driver Amplifier
TGA2506
Key Features
• 12-18 GHz Bandwidth
• 17 dB Nominal Gain
• > 14 dBm P1dB
• Bias: 5,6,7 V, 40 ± 10% mA Self Bias
• 0.5 um 3MI mmW pHEMT Technology
• Chip Dimensions: 1.19 x 0.83 x 0.1 mm
(0.047 x 0.031 x 0.004) in
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id = 40 mA
Primary Applications
• Point to Point Radio
20 IRL 0 • Military Ku-Band
18
Gain
-5 • Space Ku-Band
16 ORL -10 • VSAT
14
12
-15
-20
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10 -25
8 -30
8 10 12 14 16 18 20 22
Frequency (GHz)
16
14
12
10
8
6
4
2
0
11 12 13 14 15 16 17 18
Frequency (GHz)
Note: Datasheet is subject to change without notice.
1
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page Product Data Sheet
August 5, 2008
TGA2506
Preliminary Measured Data
0
-5
-10
-15
-20
-25
-30
-35
-40
11
Bias Conditions: Vd =5, 6, 7 V, Id = 40 mA
5V
7V
6V
12 13 14 15 16 17 18
Frequency (GHz)
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19
0
-5
-10 5V
-15 6V
7V
-20
-25
-30
-35
-40
11 12 13 14 15 16 17 18 19
Frequency (GHz)
5
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page Product Data Sheet
August 5, 2008
TGA2506
Assembly Process Notes
Reflow process assembly notes:
• Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C (30 seconds max).
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• No fluxes should be utilized.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
• Microwave or radiant curing should not be used because of differential heating.
• Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
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• Maximum stage temperature is 200 C.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
11
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: [email protected] Web: www.triquint.com
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet TGA2506.PDF ] |
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