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Número de pieza | BD63821EFV | |
Descripción | (BD63821EFV / BD63823EFV) Moter Drivers | |
Fabricantes | ROHM Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BD63821EFV (archivo pdf) en la parte inferior de esta página. Total 9 Páginas | ||
No Preview Available ! Moter Drivers for Printers
Motor Drivers with Brush
for Printers
BD63821EFV, BD63823EFV
No.12010EAT06
●Description
BD63821EFV/BD63823EFV series are built-in 2 channel H-bridge circuits that can drive 2pcs DC brush motor or 1pcs
stepping motor.
These drivers facilitate low power consumption by the direct PWM or PWM constant current control.
●Feature
1) Single power supply input (rated voltage of 36V)
2) Rated output current (peak): 1.0A(1.5A), 2.0A(2.8A)
3) Low ON resistance DMOS output
4) Forward, Reverse, Brake, Open
5) Power save function
6) External PWM control
7) PWM constant current control (current limit function)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) Driver for 2 DC brush motor
10) Driver for 1 stepping motor
11) FULL STEP, HALF STEP (driving stepping motor)
12) µSTEP drive by external DAC (driving stepping motor)
13) Built-in logic input pull-down resistor
14) Cross-conduction prevention circuit
15) Signal output of detecting the motor lock state (Wired-OR)
16) Signal output of detecting the abnormal states (Wired-OR)www.DataSheet.co.kr
17) Thermal shutdown circuit (TSD)
18) Over current protection circuit (OCP)
19) Under voltage lock out circuit (UVLO)
20) Over voltage lock out circuit (OVLO)
21) Ghost Supply Prevention (protects against malfunction when power supply is disconnected)
22) Electrostatic discharge: 8kV (HBM specification)
23) Adjacent pins short protection
24) Inverted mounting protection
25) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP-B28 package
26) Pin-compatible line-up
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
Datasheet pdf - http://www.DataSheet4U.net/
1 page BD63821EFV, BD63823EFV
Technical Note
●Thermal derating curve
HTSSOP-B28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
5.0 4.70W
4
Measurement machine:TH156(Kuwano Electric)
Measurement condition:ROHM board
Board size:70mm*70mm*1.6mm
(With through holes on the board)
The exposed metal of the backside is connected to the board with solder.
4.0
3.30W 3
3.0
2.0 1.85W 2
Board①:1-layer board (Copper foil on the back 0mm)
Board②:2-layer board (Copper foil on the back 15mm*15mm)
Board③:2-layer board (Copper foil on the back 70mm*70mm)
Board④:4-layer board (Copper foil on the back 70mm*70mm)
Board①:θja=86.2°C/W
Board②:θja=67.6°C/W /W
Board③:θja=37.9°C/W
Board④:θja=26.6°C/W
1.0 1.45W 1
0
25
50
75 85 100
125 150
Ambient temperature:Ta[°C]
www.DataSheet.co.kr
Fig. 2 HTSSOP-B28 Thermal derating curve
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
5/8
2012.02 - Rev.A
Datasheet pdf -
5 Page |
Páginas | Total 9 Páginas | |
PDF Descargar | [ Datasheet BD63821EFV.PDF ] |
Número de pieza | Descripción | Fabricantes |
BD63821EFV | Silicon monolithic integrated circuits | ROHM Semiconductor |
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