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PDF W9812G6JH Data sheet ( Hoja de datos )

Número de pieza W9812G6JH
Descripción 2M X 4 BANKS X 16 BITS SDRAM
Fabricantes Winbond 
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No Preview Available ! W9812G6JH Hoja de datos, Descripción, Manual

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W9812G6JH
2M × 4 BANKS × 16 BITS SDRAM
Table of Contents-
1. GENERAL DESCRIPTION .............................................................................................................. 3
2. FEATURES...................................................................................................................................... 3
3. AVAILABLE PART NUMBER .......................................................................................................... 3
4. PIN CONFIGURATION.................................................................................................................... 4
5. PIN DESCRIPTION ......................................................................................................................... 5
6. BLOCK DIAGRAM........................................................................................................................... 6
7. FUNCTIONAL DESCRIPTION ........................................................................................................ 7
7.1 Power Up and Initialization ................................................................................................. 7
7.2 Programming Mode Register .............................................................................................. 7
7.3 Bank Activate Command .................................................................................................... 7
7.4 Read and Write Access Modes .......................................................................................... 7
7.5 Burst Read Command ........................................................................................................ 8
7.6 Burst Write Command......................................................................................................... 8
7.7 Read Interrupted by a Read ............................................................................................... 8
7.8 Read Interrupted by a Write................................................................................................ 8
7.9 Write Interrupted by a Write ................................................................................................ 8
7.10 Write Interrupted by a Read................................................................................................ 8
7.11 Burst Stop Command.......................................................................................................... 9
7.12 Addressing Sequence of Sequential Mode......................................................................... 9
7.13 Addressing Sequence of Interleave Mode.......................................................................... 9
7.14 Auto-precharge Command................................................................................................ 10
7.15 Precharge Command........................................................................................................ 10
7.16 Self Refresh Command..................................................................................................... 10
7.17 Power Down Mode............................................................................................................ 11
7.18 No Operation Command ................................................................................................... 11
7.19 Deselect Command .......................................................................................................... 11
7.20 Clock Suspend Mode........................................................................................................ 11
8. OPERATION MODE...................................................................................................................... 12
9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13
9.1 Absolute Maximum Ratings .............................................................................................. 13
9.2 Recommended DC Operating Conditions ........................................................................ 13
Publication Release Date: Sep. 08, 2010
- 1 - Revision A04
Datasheet pdf - http://www.DataSheet4U.net/

1 page




W9812G6JH pdf
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W9812G6JH
5. PIN DESCRIPTION
PIN NUMBER PIN NAME
23 26, 22,
29 35
A0 A11
20, 21
BS0, BS1
FUNCTION
Address
Bank Select
DESCRIPTION
Multiplexed pins for row and column address.
Row address: A0 A11. Column address: A0 A8.
Select bank to activate during row address latch time,
or bank to read/write during address latch time.
2, 4, 5, 7, 8,
10, 11, 13, 42,
44, 45, 47, 48,
50, 51, 53
DQ0
DQ15
Data Input/
Output
Multiplexed pins for data output and input.
Disable or enable the command decoder. When
19 CS Chip Select command decoder is disabled, new command is
ignored and previous operation continues.
18
RAS
Row Address
Strobe
Command input. When sampled at the rising edge of
the clock, RAS , CAS and WE define the
operation to be executed.
17
CAS
Column Address
Strobe
Referred to
RAS
16 WE Write Enable Referred to RAS
39, 15
UDQM/
LDQM
Input/Output
Mask
The output buffer is placed at Hi-Z (with latency of 2)
when DQM is sampled high in read cycle. In write
cycle, sampling DQM high will block the write
operation with zero latency.
38
CLK
Clock Inputs
System clock used to sample inputs on the rising edge
of clock.
CKE controls the clock activation and deactivation.
37
CKE
Clock Enable When CKE is low, Power Down mode, Suspend mode
or Self Refresh mode is entered.
1, 14, 27
28, 41, 54
3, 9, 43, 49
VDD
VSS
VDDQ
Power (+3.3V)
Ground
Power (+3.3V)
for I/O Buffer
Power for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside DRAM.
Separated power from VDD, used for output buffers to
improve noise.
6, 12, 46, 52
36, 40
VSSQ
NC
Ground for I/O Separated ground from VSS, used for output buffers to
Buffer
improve noise.
No Connection No connection
-5-
Publication Release Date: Sep. 08, 2010
Revision A04
Datasheet pdf - http://www.DataSheet4U.net/

5 Page





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W9812G6JH
7.17 Power Down Mode
The Power Down mode is initiated by holding CKE low. All of the receiver circuits except CKE are
gated off to reduce the power. The Power Down mode does not perform any refresh operations,
therefore the device can not remain in Power Down mode longer than the Refresh period (tREF) of the
device.
The Power Down mode is exited by bringing CKE high. When CKE goes high, a No Operation
Command is required on the next rising clock edge, depending on tCK. The input buffers need to be
enabled with CKE held high for a period equal to tCKS (min) + tCK (min).
7.18 No Operation Command
The No Operation Command should be used in cases when the SDRAM is in a idle or a wait state to
prevent the SDRAM from registering any unwanted commands between operations. A No Operation
Command is registered when CS is low with RAS , CAS , and WE held high at the rising edge of
the clock. A No Operation Command will not terminate a previous operation that is still executing, such
as a burst read or write cycle.
7.19 Deselect Command
The Deselect Command performs the same function as a No Operation Command. Deselect
Command occurs when CS is brought high, the RAS , CAS , and WE signals become don’t cares.
7.20 Clock Suspend Mode
During normal access mode, CKE must be held high enabling the clock. When CKE is registered low
while at least one of the banks is active, Clock Suspend Mode is entered. The Clock Suspend mode
deactivates the internal clock and suspends any clocked operation that was currently being executed.
There is a one clock delay between the registration of CKE low and the time at which the SDRAM
operation suspends. While in Clock Suspend mode, the SDRAM ignores any new commands that are
issued. The Clock Suspend mode is exited by bringing CKE high. There is a one clock cycle delay
from when CKE returns high to when Clock Suspend mode is exited.
- 11 -
Publication Release Date: Sep. 08, 2010
Revision A04
Datasheet pdf - http://www.DataSheet4U.net/

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