|
|
PDF VEMT3700 Data sheet ( Hoja de datos )
| Número de pieza | VEMT3700 | |
| Descripción | Silicon NPN Phototransisto | |
| Fabricantes | Vishay | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de VEMT3700 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
|
No Preview Available !
www.DataSheet.co.kr
VEMT3700
Vishay Semiconductors
Silicon NPN Phototransistor, RoHS Compliant
94 8553
DESCRIPTION
VEMT3700 is a high speed silicon NPN epitaxial planar
phototransistor in a miniature PLCC-2 package for surface
mounting on printed boards. The device is sensitive to visible
and near infrared radiation.
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible and near infrared radiation
• Fast response times
• Angle of half sensitivity: ϕ = ± 60°
• Package notch indicates collector
• Package matched with IR emitter series VSML3710
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component in accordance
RoHS 2002/95/EC and WEEE 2002/96/EC
with
APPLICATIONS
• Photo interrupters
• Miniature switches
• Counters
• Encoders
• Position sensors
• Ligth sensors
PRODUCT SUMMARY
COMPONENT
VEMT3700
Ica (mA)
0.5
Note
Test conditions see table “Basic Characteristics”
ϕ (deg)
± 60
ORDERING INFORMATION
ORDERING CODE
VEMT3700-GS08
VEMT3700-GS18
Note
MOQ: minimum order quantity
PACKAGING
Tape and reel
Tape and reel
REMARKS
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
Collector emitter voltage
Emitter collector voltage
Collector current
Collector peak current
Power dissipation
tp/T ≤ 0.1, tp ≤ 10 µs
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Acc. reflow solder profile fig. 10
Thermal resistance junction/ambient Soldered on PCB with pad dimensions: 4 mm x 4 mm
Note
Tamb = 25 °C, unless otherwise specified
SYMBOL
VCEO
VECO
IC
ICM
PV
Tj
Tamb
Tstg
Tsd
RthJA
λ0.1 (nm)
450 to 1080
PACKAGE FORM
PLCC-2
PLCC-2
VALUE
70
5
50
100
100
100
- 40 to + 100
- 40 to + 100
260
400
UNIT
V
V
mA
mA
mW
°C
°C
°C
°C
K/W
Document Number: 81478
Rev. 1.5, 05-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
521
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
www.DataSheet.co.kr
VEMT3700
Silicon NPN Phototransistor, RoHS Compliant Vishay Semiconductors
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
Adhesive tape
Blister tape
Component cavity
Fig. 11 - Blister Tape
94 8670
3.5 2.2
3.1 2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 12 - Tape Dimensions in mm for PLCC-2
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
94 8158
120°
10.0
9.0
4.5
3.5
2.5
1.5
13.00
12.75
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
180
178
14.4 max.
Fig. 14 - Dimensions of Reel-GS08
63.5
60.5
94 8665
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Fig. 15 - Dimensions of Reel-GS18
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
> 160 mm
40 empty
compartments
min. 75 empty
compartments
Tape leader
Carrier leader
Carrier trailer
Fig. 13 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments. The
tape leader may include the carrier tape as long as the cover
tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least 75
empty compartments and sealed with cover tape.
Document Number: 81478
Rev. 1.5, 05-Sep-08
For technical questions, contact: [email protected]
www.vishay.com
525
Datasheet pdf - http://www.DataSheet4U.net/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet VEMT3700.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| VEMT3700 | Silicon NPN Phototransisto | Vishay |
| VEMT3700F | Silicon NPN Phototransisto | Vishay |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |