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PDF TD62081APG Data sheet ( Hoja de datos )

Número de pieza TD62081APG
Descripción 8ch Darlington Sink Driver
Fabricantes Toshiba Semiconductor 
Logotipo Toshiba Semiconductor Logotipo



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No Preview Available ! TD62081APG Hoja de datos, Descripción, Manual

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TD62081~084APG/AFG
Toshiba Bipolar Digital Integrated Circuit Silicon Monolithic
TD62081APG,TD62081AFG,TD62082APG,TD62082AFG,
TD62083APG,TD62083AFG,TD62084APG,TD62084AFG
8ch Darlington Sink Driver
The TD62081APG/AFG Series are high-voltage, high-current
darlington drivers comprised of eight NP darlington pairs.
All units feature integral clamp diodes for switching inductive loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
Output current (single output)
500 mA (max) (TD62081APG/AFG series)
High sustaining voltage output
50 V (min) (TD62081APG/AFG series)
Output clamp diodes
Inputs compatible with various types of logic.
Package type-APG: DIP-18 pin
Package type-AFG: SOP-18 pin
Type
TD62081APG/AFG
TD62082APG/AFG
TD62083APG/AFG
TD62084APG/AFG
Input Base
Resistor
External
10.5-kΩ + 7 V
Zenner diode
2.7 k
10.5 k
Designation
General purpose
14 V to 25 V
PMOS
TTL, 5 V CMOS
6 V to 15 V
PMOS, CMOS
Pin Connection (top view)
O1 O2 O3 O4 O5 O6 O7 O8 COMMON
18 17 16 15 14 13 12 11 10
Weight
DIP18-P-300-2.54D : 1.47 g (typ.)
SOP18-P-375-1.27 : 0.41 g (typ.)
123456789
I1 I2 I3 I4 I5 I6 I7 I8 GND
1 2006-06-13
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TD62081APG pdf
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TD62081~084APG/AFG
Test Circuit
1. ICEX
Open
VIN
Open
ICEX
VCE
2. VCE (sat), hFE
Open
IIN IOUT
3. IIN (ON)
IIN (ON)
VCE, VCE (sat)
hFE =
IOUT
IIN
VIN
Open
Open
4. IIN (OFF)
IIN (OFF)
Open
7. VF
Open
VF
5. VIN (ON)
IOUT
VIN (ON)
IF
Open
VCE
6. IR
IOUT
Open
Open
IR VR
Open
5 2006-06-13
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TD62081APG arduino
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TD62081~084APG/AFG
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
11
2006-06-13
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