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PDF MAX14503 Data sheet ( Hoja de datos )
| Número de pieza | MAX14503 | |
| Descripción | (MAX14500 - MAX14503) Hi-Speed USB-to-SD Card Readers | |
| Fabricantes | Maxim Integrated Products | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MAX14503 (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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19-4117; Rev 1; 4/09
EVAALVUAAILTAIOBNLEKIT
Hi-Speed USB-to-SD Card
Readers with Bypass
General Description
The MAX14500–MAX14503 USB-to-SD™ card readers
provide a means for portable devices that support full-
speed USB communication (12Mbps) with one or two
SD card slots, upgrading the USB SD card reader func-
tion to USB Hi-Speed (480Mbps) operation. The
MAX14500–MAX14503 have two modes of operation:
Pass Thru and Card Reader. In pass thru, the SD and
USB signals pass through the MAX14500–MAX14503
without modification, appearing like the device is not
present. The host microprocessor firmware does not
need modification, as there is no change from the host
microprocessor’s perspective. In Card Reader mode,
the MAX14500–MAX14503 implement a Hi-Speed USB
card reader that operates independently of the host
microprocessor. All the capabilities of the full-speed
USB port and SD card slot are preserved with the addi-
tional feature that allows a faster way for a PC to read or
write to the SD card. The MAX14500–MAX14503 sup-
port SD high capacity SDHC cards. The 40-pin TQFN
version supports one SD card, while the 56-bump WLP
version supports two SD cards.
The MAX14500–MAX14503 feature advanced power-
saving modes to reduce power consumption in
portable applications. The low-power Sleep modes
allow the ability to disable internal circuit blocks, pro-
viding power-saving operating modes. The default
clock input for each part number is specified in the
ordering information. The MAX14500–MAX14503 fea-
ture the option to change the default values using the
I2C interface.
The MAX14500–MAX14503 are available in 5mm x
5mm, 40-pin TQFN, and 3.23mm x 3.5mm, 56-bump
WLP packages. These devices operate over a wide
supply voltage range and are specified over the -40°C
to +85°C extended temperature range.
Cell Phones
PDAs
MP3 Players
Digital Still Cameras
GPS
Applications
Features
♦ USB 2.0 Hi-Speed and Full-Speed Compliant
♦ SDHC Card Support
♦ Internal Hi-Speed USB SD Card Reader Eases
Host µP Overhead
♦ On-Chip Termination and Pullup Resistors
♦ Internal SD Switches Allow For Multiplexing Two
SD Cards on a Single-Microprocessor SD Port
♦ Accommodates Clock Input Frequencies
26MHz, 19.2MHz, 13MHz, and 12MHz
♦ Internal Clock Squarer for Low-Amplitude TCXO
Signals
♦ No Power-Supply Sequencing Required
♦ Compatible with +1.8V to +3.3V I/O Host
Microprocessor
♦ Simple Control Mode Requires Only a Single
GPIO
♦ I2C Control Provides Multiple Configuration
Options
♦ I2C Control Required for Two SD Cards
♦ On-Chip Power-On Reset/Brown-Out Reset
Ordering Information/
Selector Guide
PART
INPUT
FREQUENCY
(MHz)
SD
CARDS
PIN-
PACKAGE
MAX14500ETL+*
12
1 40 TQFN-EP**
MAX14500AEWN+*
12
2 56 WLP
MAX14501ETL+*
13
1 40 TQFN-EP**
MAX14501AEWN+*
13
2 56 WLP
MAX14502AETL+
19.2
1 40 TQFN-EP**
MAX14502AEWN+*
19.2
2 56 WLP
MAX14503ETL+*
26
1 40 TQFN-EP**
MAX14503AEWN+*
26
2 56 WLP
Note: All devices are specified over the -40°C to +85°C oper-
ating temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Future product—contact factory for availability.
**EP = Exposed pad.
SD is a trademark of the SD Card Association.
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
www.DataSheet.co.kr
Hi-Speed USB-to-SD Card
Readers with Bypass
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise
noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Clock Low Period
Clock High Period
tLOW_I2C
tHIGH_I2C
1.3 µs
0.6 µs
Setup Time for Repeated START
tSU,STA
0.6 µs
Hold Time for Data
tHD,DAT
0 0.9 µs
Setup Time for Data
SDA/SCL Input Fall Time
tSU,DAT
tF_I2C
100 ns
300 ns
SDA/SCL Rise Time
tR_I2C
300 ns
Setup Time for STOP
tSU,STO
0.6 µs
Bus Free Time Between STOP
and START
tBUF
1.3 µs
USB HI-SPEED SOURCE ELECTRICAL CHARACTERISTICS
(VCC = +2.4V to +3.6V, VSD = +2.4V to +3.6V, VIO = +1.5V to +3.6V, VTM = +2.91V to +3.4V, TA = -40°C to +85°C, unless otherwise
noted. Typical values are at VCC = +3.3V, VIO = +2.5V, VSD = +2.5V, VTM = +3.3V, TA = +25°C.) (Note 2)
PARAMETER
DC CHARACTERISTICS
Hi-Speed Squelch Detection
Threshold (Diff Signal Amplitude)
Hi-Speed Differential Input
Signaling Levels
Hi-Speed Data Signaling
Common-Mode Voltage Range
Hi-Speed Idle Level
Hi-Speed Data Signaling High
Hi-Speed Data Signaling Low
Chirp J Level (Differential
Voltage)
Chirp K Level (Differential
Voltage)
Termination Voltage (Hi-Speed)
AC CHARACTERISTICS
Rise Time
Fall Time
Driver Waveform Requirements
Driver-Output Resistance
Source Jitter Total (Including
Frequency Tolerance)
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
VHSSQ (Note 6)
100
VIL Specified by Hi-Speed receive eye diagram
SCM (Note 6)
VHSOI
VHSOH
VHSOL
VCHIRPJ
-50
-10
360
-10
700
VCHIRPK
VHSTERM
-900
-10
150 mV
+500
+10
440
+10
1100
-500
+10
mV
mV
mV
mV
mV
mV
mV
tHSR
tHSF
ZHSDRV
(Note 6)
(Note 6)
Specified by Hi-Speed transmit eye diagram
Specified by Hi-Speed transmit eye diagram
500
500
See the Typical Operating
Characteristics section
40.5 49.5
See the Typical Operating
Characteristics section
ps
ps
Ω
_______________________________________________________________________________________ 5
Datasheet pdf - http://www.DataSheet4U.net/
5 Page 
www.DataSheet.co.kr
Hi-Speed USB-to-SD Card
Readers with Bypass
PIN
TQFN
WLP
— C5
— A4
— G4
— G3
POWER SUPPLY
5 A6
23 F6
38 B1, B2
39 B3, C3
40 A1
18, 24, 26, C1, C2, E7,
37 E8, G5, G6
NO CONNECTION
35, 36
D4, E4
EXPOSED PAD
——
Pin Description (continued)
NAME
HDAT2_2
HDAT2_3
HCMD2
HCLK2
FUNCTION
SD Card 2 Data Bus Analog Switch. HDAT2_2 connects to DAT2 on the SD port of
the host µP.
SD Card 2 Data Bus Analog Switch. HDAT2_3 connects to DAT3 on the SD port of
the host µP.
SD Card 2 Command Analog Switch. HCMD2 connects to CMD on the SD port of the
host µP.
SD Card 2 Clock Analog Switch. HCLK2 connects to CLK on the SD port of the host µP.
VIO
VTM
CLDO
VCC
VSD
GND
I/O Logic-Level Translator Voltage. Bypass VIO to GND with a 0.1µF ceramic
capacitor. VIO powers the logic inputs/outputs and I2C block.
USB Analog Switch and Transceiver Power Supply. Bypass VTM to GND with a 0.1µF
ceramic capacitor.
Bypass Capacitor for Internal +1.8V LDO. Connect a 1µF ceramic capacitor (X7R,
X5R, or better) from CLDO to GND. CLDO must not be used to power external
circuitry.
Digital Supply Voltage. Bypass VCC to GND with a 1µF ceramic capacitor (X7R, X5R,
or better).
SD Card Voltage. Bypass VSD to GND with a 1µF ceramic capacitor (X7R, X5R, or
better).
Ground
N.C.
EP
No Connection. Connect N.C. to GND.
Exposed Pad. Connect EP to GND. Do not use EP as the sole GND connection.
______________________________________________________________________________________ 11
Datasheet pdf - http://www.DataSheet4U.net/
11 Page | ||
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| PDF Descargar | [ Datasheet MAX14503.PDF ] | |
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