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PDF CI-B2012-xxxxJx Data sheet ( Hoja de datos )

Número de pieza CI-B2012-xxxxJx
Descripción CHIP CERAMIC INDUCTORS
Fabricantes Ceratech 
Logotipo Ceratech Logotipo



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ITEM
CHIP CERAMIC INDUCTORS
Features
1. SMD type chip inductors utilizing monolithic structure provide highly reliable surface mount applications.
2. Superior Q characteristics is guaranteed over the wide frequency range to allow high frequency applications.
3. Terminal electrode has excellent solder heat resistance for soldering.
Applications
1. RF module of telecommunication products.
- Cellular phone, Cordless telephone, Pagers etc.
2. GSM Phone, PCS Phone.
3. Computer communications, Radar detectors.
4. Automotive electronics, Keyless remote.
PAGE
Ordering Information
CI - B 1608 - 120 - K J T
(1) (2) (3)
(4) (5) (6) (7)
(1) Series
(2) Material & design
(3) Dimensions
The first two digits : length( )
The last two digits : width( )
(4) Inductance
The first two digits are signigicant.
The last digit is the number of zeros following.
N : a decimal point placed between first two digits
(5) Tolerance
S : 0.3nH
J : 5%
K : 10%
(6) Termination
J : Nickel barrier
Packing
B : Bulk Packing
T : Tape & Reel (
L : Tape & Reel (
178
254
[ 7inches])
[10inches])
Shape and Dimensions
unit : mm [inches]
Type
L
W
T
C
CI- 1005-
1.0 0.10
.039 .004
0.5 0.10
.020 .004
0.5 0.10
.020 .004
0.20 0.10
.008 .004
CI- 1608-
1.6 0.15
.063 .006
0.8 0.15
.031 .006
0.8 0.15
.031 .006
0.30 0.20
.012 .008
CI- 2012-
2.0 0.2
.079 .008
1.25 0.2
.049 .008
1.0 0.2
.047 .008
0.50 0.30
.020 .012
The polarity mark can be provided upon customer's request.
CERATECH CORPORATION

1 page




CI-B2012-xxxxJx pdf
ITEM
CHIP CERAMIC INDUCTORS
PAGE
RELIABILITY AND TEST CONDITIONS
CHIP CERAMIC INDUCTORS
ITEM
1005
REQUIREMENTS
1608
2012
TEST CONDITION
Operating temp.
range
Storage temp. &
humidity range
Resistance to
solder heat
Solderability
Reflow soldering
Tensile strengh
(Terminalstrength)
-55 ~+125
-
40 max. , 70% RH max.
at packing condition
1.No damage such as cracks should be caused in chip element.
2.More than 75% of the terminal electrode shall be covered with new
solder.
3.Inductance change : within 5%
4.Quality factor change : within 30%
1.More than 90% of the terminal electrode shall be covered with new
solder.
2.Inductance change : within 5%
3.Quality factor change : within 30%
1.More than 50% of the terminal electrode shall be covered with new
solder.
1.No mechanical damage
Preheat
temperature : 100 to 150
Preheat time : 1min
Solder
temperature : 260 10
Dipping time : 10 0.5sec.
Preheat
temperature : 100 to 150
Preheat time : 1min
Solder
temperature : 230 10
Dipping time : 3 1sec.
Preheat
temperature : 150
Preheat time : 1min
Solder
temperature : 230
Soldering time : 10 sec. Max.
(Reflow soldering profile)
W
Adhension of
Terminal electrode
(Flexure strength)
a
b
c
W
Body strength
(Bending strength)
-
1.No mechanical damage
1.0
Unit : Kgf(W)
2.0
Unit : mm (a,b,c), Kgf(W)
- 1.0 1.0
- 0.8 1.0
- 1.3 1.3
- 2.0 4.0
1.The body shall not be damaged by forces applied on the right.
d-
W-
Unit : mm (d), Kgf(W)
1.3 1.3
2.0 3.0
CERATECH CORPORATION

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