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PDF MAAM-007866-0P1R00 Data sheet ( Hoja de datos )
| Número de pieza | MAAM-007866-0P1R00 | |
| Descripción | Broadband Driver Amplifier | |
| Fabricantes | M/A-COM Technology | |
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MAAM-007866-0P1R00
Broadband Driver Amplifier
50 to 3300 MHz
Features
• High Gain: 27 dB (TYP.)
• Flat Broadband Gain Response: +/- 1.2 dB (TYP)
• P1dB: +23.0 dBm (TYP.)
• Flexibility for Multi-Band Systems
• On-Chip Active Bias Network
• Lead Free 3 mm PQFN Surface Mount Package
• 260oC Reflow Capability
Applications
• LO Buffer Amplifier
• Driver Stage for Power Amplifiers
• Basestation / Repeater Applications
• Broadband RF Gain Block
Product Image
Functional Block Diagram
Rev. V1
Description
M/A-COM’s MAAM-007866-0P1R00 amplifier utilizes GaAs HBT
technology with an +18 Volt BVceo process for improved linearity
performance, power efficiency, and high reliability, in a low cost
3 mm PQFN surface mount plastic package.
The MAAM-007866-0P1R00 incorporates an on-chip active bias
Pin Configuration
network for ease of implementation, and maintains high linearity
over temperature. This 2 stage high gain design operates from a
Pin
No.
Function
Description
single +5 volt supply and has a +5 volt reference pin for power
1 No Connection No connection
down control capability
2
RF Input
RF Input Signal. External circuit required for
optimum performance
The MAAM-007866-0P1R00 requires a minimal number of external 3
RF Input
RF Input Signal. External circuit required for
optimum performance
components to achieve a flat gain response across the entire 50 to 4 No Connection or GND No Connection. GND preferred
3300 MHz frequency band.
5 No Connection or GND No Connection. GND preferred
Ordering Information1
Part Number
Package
MAAM-007866-0P1R00
www.DataSheet4U.com
MAAM-007866-0P1RA1
3 mm 12 lead PQFN
Sample Application Kit
MAAM-007866-0P1RTR
1000 Piece Tape & Reel
6 No Connection or GND No Connection. GND preferred
7
RF Output / VCC2
RF Output & 2nd Stage VCC Supply Input
External circuit required for optimum performance
8
RF Output / VCC2
RF Output & 2nd Stage VCC Supply Input
External circuit required for optimum performance
9 No Connection No Connection
10
11
12
Pkg
Base
VCONT2
VCC1
VCONT1
GND
DC Control Input to 2nd Stage Bias circuit.
External resistor required for normal operation @ 5V.
Can be combined with VCONT1.
VCC Supply to 1st Stage. Bypass Capacitor value &
location is critical. Must be as close to the pin as
possible. See Eval Board Layout.
DC Control Input to 1st Stage Bias circuit.
See application circuit.
RF/DC GND and thermal Path to PCB Vias.
Sufficient Vias must be provided for thermal
considerations. See PCB Layout
1. Reference Application Note M513 for reel size information.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
1 page  
MAAM-007866-0P1R00
Broadband Driver Amplifier
50 to 3300 MHz
EVALUATION CIRCUIT BOARD LAYOUT1,2,3
GND
Rev. V1
MAAM-007866-001
EVAL PCB1 4/06
RFIN
RFOUT
1. GETEK, 2-layer, Total Board Thickness = 32 mil.
Microstrip 50 Ohm Line width = 54 mil
Board Size: 1.4 x 1.1 inches.
2. Via Geometry shown must be used for the 3 mm QFN package backside to provide a low-inductance & low
thermal resistance path to the PCB backside ground.
At least 9 vias are required. Via Diameter = 8 mils finished size with 1.0 mils minimum plating.
www.DataSheet4U.com
3. Evaluation circuit board assemblies use SnPb (tin lead) soldering process to attach all components, and are
therefore not RoHS compliant.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MAAM-007866-0P1R00.PDF ] | |
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