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PDF TH3044 Data sheet ( Hoja de datos )
| Número de pieza | TH3044 | |
| Descripción | K-Bus Interface | |
| Fabricantes | Melexis | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TH3044 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Open-emitter output with slew rate control
Quiescent current < 50mA
Bus voltage range -16 V .. +30 V
ISO 9141 and OBDII compliant
Wide temperature range -40 .. 125 °C
SOIC14 and SOIC8 package
Baudrate 9600
Automotive applications
TH3044
K-Bus Interface
Pin Diagram
SOIC14NB
1 14 NRXD
2 13 RXD
GND 3
12
VCC 4 TH3044 11 TxD
5 10 SEN/STA
BUS 6
9
VBAT 7
8
SOIC 8
GND 1
8 N.C.
VCC 2
7 RXD
TH3044
BUS 3
6 TxD
VBAT 4
5 SEN/STA
Part No.
TH3044.2A
TH3044
Temperature Suffix
K ( -40ºC to +125ºC )
K ( -40ºC to +125ºC )
Package code
DC-14 ( SOIC14, 150mil )
DC-8 ( SOIC8 , 150mil)
The TH3044 is a bidirectional bus interface
device for data transfer from 5V to 12V
supply.For proper functionality control units
are implemented.
This interface device was especially designed
for automotive applications.
www.DataSheet4U.com
3901003044
Rev. 003
Page 1
Nov/02
1 page  
TH3044
K-Bus Interface
RxD
NRxD
TxD
SEN/STA
POR
VBAT
VCC
POR
VCC
ESD
VCC
ESD
Control-
logic
Bit-Compare
Constant-Low
tDEB
OSC
Vref
Biasing
VthH
VthL
pnp-
Control
- slew rate
- IB
- foldback
Figure 1 - Block Diagram
BUS
The TH3044 is used as a K-Bus interface. It
builds the connection between the serial 5V
bus line and the 12 V bus line. To avoid losses
of data informations control functions are
implemented.
Transmit
During the transmission the data at the pin
TxD will be transferred to the pin RxD (NRxD)
as well as to the pin BUS.
Receive
The receiving path is always transparent.
Independent of the mode the pin RxD and
NRxD (inverted) are related to signal at the pin
BUS. Voltage spikes on the bus signal are
sup-pressed by the implemented debouncing
circuit.
BUS
SEN/STA
TxD
RxD
< tdebH
< tdebL
tdebH
tdebL
BUS
To minimise the electromagnetic emission of
the bus line, the slew rate of the rising and
falling edges of the data signals are limited.
www.DataSheet4U.com
3901003044
Rev. 003
Page 5
Nov/02
5 Page 
TH3044
K-Bus Interface
!
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and
wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding
peak temperature, temperature gradient, temperature profile etc) additional classification and
qualification tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor
products.
www.DataSheet4U.com
3901003044
Rev. 003
Page 11
Nov/02
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TH3044.PDF ] | |
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