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PDF ECEVG Data sheet ( Hoja de datos )
| Número de pieza | ECEVG | |
| Descripción | Aluminum Electrolytic Capacitor/V-G | |
| Fabricantes | Panasonic Semiconductor | |
| Logotipo |  |
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Aluminum Electrolytic Capacitor/V-G
Surface Mount Type
Series: G Type : V
Discontinued
s Features Endurance :105°C 1000 h
sSpecification
Operating temp. range
Rated W.V. range
Nominal cap. range
Capacitance tol.
DC leakage current
-40 to + 105°C
6.3 to 50 V .DC
0.1 to 470 µ F
±20 % (120Hz/+20°C)
I < 0.01 CV or 3 (µ A) after 2 minutes (Whichever is the greater)
tan δ
(120Hz / +20°C)
W.V. 6.3 10 16 25 35 50
tan δ 0.30 0.22 0.16 0.14 0.12 0.12
Characteristics
at Low Temperature
Endurance
Shelf life
Resistance to
Soldering Heat
W.V. (V) 6.3 10 16 25 35 50
-25 / +20 °C 4 3 2 2 2 2 ( Impedance ratio at 120 Hz)
-40 / +20 °C 8 6 4 4 3 3
After applying rated working voltage for 1000 hours at +105 ± 2°C, and then being atabilized at
+20°C, capacitors shall meet following limits.
Capacitance change < ±20% of initial measured value
tan δ
< 200% of initial specified value
DC leakage current < initial specified value
After storage for 1000 hours at +105 ±2°C with no voltage applied and then being stabilized
at +20°C, capacitor shall meet the limits specified in “Endurance”.
After reflow soldering (230°C of peak temperature and reflow time less than 20 seconds.) and
then being stabilized at 20°C, capacitor shall meet the following limits, (Infrared ray oven is also
available.)
Capacitance change < ±10% of initial measured value
tan δ
< initial specified value
DC leakage current < initial specified value
sExplanation of Part Number
ECE
Common code
V
Shape
s Marking
G
W.V. code Series code Capacitance code
Suffix
Taping
R W=12 mm φ4(B)
P W=16 mm φ5,φ6.3,φ8x6.2(C,D,E)
P W=24 mm φ8x10.2, φ10x10.2(F,G)
s Dimensions in mm (not to scale)
Example : 50V22µF
0.3 max
@A±0.2 ( ) reference size
Rated voltage (V.DC)
(-): Negative polarity
marking
www.DataSheet4U.com
22
50 G
Capacitance (µF)
Series identification
E,F,G= L±0.3
L+-00..21
w
(mm)
Size
code
D
L
A
H
I
B 4.0 5.4 4.3 5.5 MAX 1.8
C 5.0 5.4 5.3 6.5MAX 2.2
D 6.3 5.4 6.6 7.8MAX 2.6
E 8.0 6.2 8.3 9.5MAX 3.4
F 8.0 10.2 8.3 10.0MAX 3.4
G 10.0 10.2 10.3 12.0MAX 3.5
WP
0.65 ±0.1 1.0
0.65±0.1 1.5
0.65± 0.1 1.8
0.65±0.1 2.2
0.90±0.2 3.1
0.90±0.2 4.6
K
0.35 -0.20 to +0.15
0.35 -0.20 to +0.15
0.35 -0.20 to +0.15
0.35 -0.20 to +0.15
0.70 ±0.2
0.70 ±0.2
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
Ñ EE3 Ñ
1 page  
Aluminum Electrolytic Capacitor
1.3 Common Application Conditions to Avoid
The following misapplication load conditions will
cause rapid deterioration to capacitor electrical
parameters. ln addition, rapid heating and gas
generation within the capacitor can occur causing
the pressure relief vent to operate and resuItant
leakage of electrolyte. Under extreme conditions,
explosion and fire could result. Leakinq electrolyte
is combustible and electrically conductive.
(1) Reverse Voltaqe
DC capacitors have polarity. Verify correct polarity
before inser tion. For circuits with changing or
uncertain polarity,use DC bipolar capacitors. DC
bipolar capacitors are not suitable for use in AC
circuits.
(2) Charqe/Discharqe Applications
Standard capacitors are not suitable for use in
repeating charge/discharge applications. For
charqe/discharqe applications consult us and advise
actual conditions.
(3) Overvoltage
Do not appIy voltaqes exceeding the maximum
specified rated voltages. Voltage up to the surge
voltage rating are acceptable for short periods of
time. Ensure that the sum of the DC voltage and
the superimposed AC ripple voltage does not
exceed the rated voltage.
(4) Ripple Current
Do not apply ripple currents exceeding the maximum
specified value. For high ripple current applications,
use a capacitor designed for high rippIe currents
or contact us with your requirements.
Ensure that allowable ripple currents superimposed
on low DC bias voltages do not cause reverse voltage
conditions.
1.4 Using Two or More Capacitors in Series
or Parallel
(1) Capacitors Connected in Parallel
The circuit resistance can closely approximate the
series resistance of the capacitor causing an
imbalance of ripple current loads within the
capacitors. Careful design of wiring methods can
minimize the possibility of excessive ripple currents
applied to a capacitor.
(2) Capacitors Connected in Series
Normal DC leakage current differences among
capacitors can cause voltage imbalances. The use
of voltage divider shunt resistors with consideration
to leakage currents, can prevent capacitor voltage
imbaIances.
1.5 Capacitor Mounting Considerations
www.(D1a)taDSoheuebt4IeU.-coSmided Circuit Boards
Avoid wiring Pattern runs which pass between
the mounted capacitor and the circuit board. When
dipping into a solder bath, excess solder may collect
under the capacitor by capillary action and
shortcircuit the anode and cathode terminals.
(2) Circuit Board Hole Positioning
The vinyl sleeve of the capacitor can be damaged
if solder passes through a lead hole for
subsequently processed parts. Special care when
locating hole positions in proximity to capacitors is
recommended.
(3) Circuit Board Hole Spacing
The circuit board holes spacing should match the
capacitor lead wire spacing within the specified
tolerances. Incorrect spacing can cause excessive
lead wire stress during the insertion process. This
may resuIt in premature capacitor failure due to
short or open circuit, increased leakage current,
or electrolyte leakage.
(4)Land/Pad Pattern
The circuit board land/pad pattern size for chip
capacitors is specified in the following table.
[ Table of Board Land Size vs. Capacitor Size ]
c
b a b Board land part
(mm)
Size a b c
A(φ3)
0.6 2.2 1.5
B(φ4)
1.0 2.5. 1.6
C(φ5)
1.5 2.8 1.6
D(φ6.3)
1.8 3.2 1.6
E(φ8 x 6.2L)
2.2 4.0 1.6
F(φ8 x 10.2L)
3.1 4.0 2.0
G(φ10 x 10.2L) 4.6 4.1 2.0
Among others, when the size a is wide , back fillet can
not be made, decreasing fitting strength.
h Decide considering mounting condition, solderability
and fitting strength, etc. based on the design
standards of your company.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.
Mar. 2005
– EE18 –
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet ECEVG.PDF ] | |
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