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PDF SDM088HBA Data sheet ( Hoja de datos )
| Número de pieza | SDM088HBA | |
| Descripción | DIP POWER CHOKE COIL | |
| Fabricantes | Superworld Electronics | |
| Logotipo |  |
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DIP POWER CHOKE COIL
SDM088HBA SERIES
1. PART NO. EXPRESSION :
SDM088HBA-1R2MF
(a) (b)
(c) (d)(e)
(a) Series code
(b) Dimension code
(c) Inductance code : 1R2 = 1.20uH
(d) Tolerance code : M = ±20%
(e) F : RoHS Compliant
2. CONFIGURATION & DIMENSIONS :
AF
1R2
F
G
8.0
PCB Pattern
ØW
Unit:m/m
Series
A B C D F ØW G
SDM088HBA-1R2MF 8.0 Max. 8.0 Max. 8.0 Max. 3.4±0.5 5.0±0.5 0.8±0.1 1.1 Typ.
SDM088HBA-1R6MF 8.0 Max. 8.0 Max. 8.0 Max. 3.4±0.5 5.0±0.5 0.7±0.1 1.0 Typ.
3. SCHEMATIC :
4. MATERIALS :
(a) Core : e Iron Core
(b) Wire : Enamelled Copper Wire
(c) Solder : Sn99.95%-Cu0.05%
5. GENERAL SPECIFICATION :
a) Test Frequency : 100KHz/1.0V
b) Operating temp. : -40°C to +125°C
c) Ambient temp. : 20°C
d) Irms (A) : Will cause an approximately temp. rise ǻT < 40°C
e) Isat (A) : Will cause L0 to drop approximately 20%
www.DataSf)hPeaertt4tUem.cpoemrature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
01.04.2010
LTD
PG. 1
1 page  
DIP POWER CHOKE COIL
SDM088HBA SERIES
9. SOLDERIND AND MOUNTING :
9-1. Recommended PC Board Pattern
F
G
8.0
Series
Unit:m/m
FG
SDM088HBA-1R2MF 5.0±0.5 1.1 Typ.
SDM088HBA-1R6MF 5.0±0.5 1.0 Typ.
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Preheating Soldering
250~260
230
10s max.
180
150
Natural
cooling
60~120s
30~60s
Figure 1. Re-flow Soldering
Preheating Soldering
350
300
150
Natural
cooling
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 2. Iron Soldering
www.DataSheet4U.com
NOTE : Specifications subject to change without notice. Please check our website for latest information.
SUPERWORLD ELECTRONICS
(S)
PTE
01.04.2010
LTD
PG. 5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SDM088HBA.PDF ] | |
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