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PDF FAN7535 Data sheet ( Hoja de datos )
| Número de pieza | FAN7535 | |
| Descripción | PFC & Ballast Control IC | |
| Fabricantes | Fairchild Semiconductor | |
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December 2007
FAN7535
PFC & Ballast Control IC
Features
PFC, Ballast Control, and Half-Bridge Driver in One IC
PFC Driver Current Capability: +500mA/-800mA
Critical Conduction Mode Control Type PFC
Internal Clamping Zener Diode (PFC): 23V
Under-Voltage Lockout with 3.5V of Hysteresis (PFC)
Internal Clamping Zener Diode (Ballast): 15V
Lower di/dt Gate Driver for Better Noise Immunity
Under-Voltage Lockout with 1.8V Hysteresis (Ballast)
Ballast Driver Current Capability: +350mA/-650mA
Programmable Preheat Time & Frequency
Programmable Run Frequency
Programmable Ignition Sweep Time
Internal Active ZVS Control
Internal Protection Function (Latch Mode)
Description
FAN7535 provides simple, high-performance, active
power factor correction (PFC), and ballast control. The
FAN7535 is optimized for all kinds of fluorescent lamps,
which require minimum board area and reduced
external components. The FAN7535 PFC control block
to reduce the input current THD lower than conventional
CRM boost PFC methods. An innovative Active Zero
Voltage Switching (AZVS) block reduces the swtiching
power loss. A dedicated timing section in the FAN7535
allows the user set the necessary parameters for proper
lamp preheat and ignition.
24-SOP
Applications
Fluorescent Lamp Ballast
Ordering Information
Part Number
FAN7535M
FAN7535MX
Package
24-SOP
Operating Temperature Range
-25°C ~ 125°C
All packages are lead free per JEDEC: J-STD-020B standard.
Packing Method
Tube
Tape & Reel
© 2007 Fairchild Semiconductor Corporation
FAN7535 Rev. 1.0.0
www.DataSheet.in
www.fairchildsemi.com
1 page  
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA=25°C, unless otherwise specified.
Symbol Parameter
PFC PART
Min. Typ. Max. Unit
VDDP Supply Voltage
IOH, IOL Peak Drive Output Current
lCLAMP Driver Output Clamping Diodes VO > VCC or VO < -0.3V
lDET Detector Clamping Diodes
VIN Error Amplifier, MOT, CS Input Voltages
BALLAST PART
VB High-side Floating Supply
VS High-side floating supply return
VIN RT, CPH Pins Input Voltage
VCL Clamping Voltage
ICL Clamping Current Level
dVS/dt Allowable Offset Voltage Slew Rate
Common
Vz V
-800
+500
±10 mA
±10
-0.3 6.0 V
-0.3 625.0
-0.3 600.0
V
-0.3 8.0
VCL
25 mA
50 V/ns
TOPR
TSTG
PD
θJA
Operating Temperature Range
Storage Temperature Range
Total Power Dissipation
Thermal Resistance (Junction-to-Air)
-25 +125
°C
-65 +150
1.5 W
83 °C/W
Caution:
Do not supply a low-impedance voltage source to the internal clamping Zener diode between the GND and the VDDB
and VDDP pins of this device. Use a common supply between the two ICs (PFC, Ballast) only under careful attention.
© 2007 Fairchild Semiconductor Corporation
FAN7535 Rev. 1.0.0
www.DataSheet.in
5
www.fairchildsemi.com
5 Page 
Package Dimensions
24
B
7.50±0.10
10.325
15.40±0.20
13.970
A
13
14.52
10.95
9.2
PIN ONE
INDICATOR
1
0.51
0.35
0.25 M C B A
12
1.27
1.75 TYP
1.27 TYP
0.55 TYP
LAND PATTERN RECOMMENDATION
2.65 MAX
M24BREV2
(R0.10)
(R0.10)
8°
0°
0.40~1.27
(1.40)
0.20±0.10
0.75
0.25
X 45°
C
0.10 C
GAGE PLANE
0.25
SEATING PLANE
DETAIL A
SCALE: 2:1
SEE DETAIL A
0.33
0.20
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, ISSUE E, DATED SEPT 2005.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATERN STANDARD: SOIC127P1030X265-24L
E) DRAWING FILENAME: MKT-M24BREV2
Figure 4. 24-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor
representative to verify or obtain the most recent revision. Package specifications do not expand the terms of
Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2007 Fairchild Semiconductor Corporation
FAN7535 Rev. 1.0.0
www.DataSheet.in
11
www.fairchildsemi.com
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet FAN7535.PDF ] | |
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