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PDF ELJ-750-629 Data sheet ( Hoja de datos )
| Número de pieza | ELJ-750-629 | |
| Descripción | Jumbo-LED | |
| Fabricantes | EPIGAP | |
| Logotipo |  |
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Jumbo-LED
Radiation
Infrared
5,08
12
Type
4W
ELJ-750-629
20.11.2007
rev. 01
Technology
AlGaAs/AlGaAs
Case
Plastic lens, metal case
Description
High-power infrared LED in an aluminium case, with
thread socket for easy handling and heat sink
mounting
12
M10
Outline:
H = 12.4 mm (± 0.5)
D = 16 mm (± 0.5)
Thread M10
Pin 1 – cathode
Pin 2 – anode
Applications
Medical appliances, remote control and optical
communications, light barriers, measurement systems
Absolute Maximum Ratings
at Tamb = 25°C, on heat sink (S ≥ 200 cm²), unless otherwise specified
Parameter
Test сonditions
DC forward current
on heat sink
Peak forward current
Power dissipation
tp≤10 µs, f≤500 Hz
on heat sink
Operating temperature range
on heat sink
Storage temperature range
on heat sink
Junction temperature
on heat sink
Symbol
IF
IFM
P
Tamb
Tstg
Tj
Value
1.2
2.0
4
-25 to +100
-25 to +100
100
Unit
A
A
W
°C
°C
°C
Electrical Characteristics
Tamb = 25°C, unless otherwise specified
Parameter
Test
conditions
Symbol
Min
Typ Max
Unit
Forward voltage
IF = 350 mA
VF
1.9 2.5
V
Forward voltage*
IF = 1000 mA
VF
2.5 3
V
Switching time
IF = 350 mA
tr, tf
60
ns
Reverse voltage
IR = 10 µA
Thermal resistance
junction-case
*only recommended on optimal heat sink
VR
RthJC
5
10
K/W
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications.All operating parameters must be validated for each customer application by the customer.
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
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Jumbo-LED
Handling precautions
ELJ-750-629
20.11.2007
rev. 01
To prevent damage to the LED during soldering and assembly, following precautions have to be
taken into account.
a) The bending point of the lead frame
should be located at least 2.5 mm away
from the body.
b) While bending, the base of the lead
frame has to be fixed with radio pliers or
similar.
c) To ensure an adequate strain relief, the
lead frames have to be firmly fixed during
soldering.
d) Avoid any torsion or tensile loading of
the lead frames, especially when they
have been heated after being soldered.
e) LEDs are static sensitive devices, so
adequate handling precautions have to be
taken, e.g. wearing grounding wrist straps.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications.All operating parameters must be validated for each customer application by the customer.
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
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| PDF Descargar | [ Datasheet ELJ-750-629.PDF ] | |
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