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PDF EMIF06-MSD01F2 Data sheet ( Hoja de datos )
| Número de pieza | EMIF06-MSD01F2 | |
| Descripción | Mini and micro SD Card | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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EMIF06-mSD01F2
IPAD™
Mini and micro SD Card - EMI filtering and 25 kV ESD protection
Main application
Mini and micro (T-Flash) Secure Digital memory
card in mobile phones and communication
systems
Description
The EMIF06-mSD01F2 is a highly integrated
device based on IPAD technology with the
following functions:
■ ESD protection to comply with IEC standard
■ EMI Filtering to reject mobile phone
frequencies
Benefits
■ EMI Low-pass-filter
■ ESD protection ±25 kV (IEC 61000-4-2)
■ Integrated pull up resistors to prevent bus
floating when no card is connected
■ 50 Mhz clock frequency compatibility with
Cline< 20 pF
■ Low power consumption
■ Easy Layout thanks to smart pin-out
configuration
■ Very low PCB space consuming
■ High reliability offered by monolithic integration
■ Reduction of parasitic elements thanks to CSP
integration
■ Lead free package
■ Coated version option upon request
Complies with the following standards:
IEC 61000-4-2
level 4
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3A
SD Card Specification Ver. 1.01
MicroSD Card Specification Ver. 1.0
Physical layer specification, Part 1 vesion 1.1
Flip-Chip
(16 Bumps)
Pin configuration (bump side)
43 21
A
B
C
D
A1 DATA0 C1
CMD
A2 DATA1 C2
Vss
A3 SDDATA1 C3
Vss
A4 SDDATA0 C4
SDCMD
B1 CLK D1 DATA3/CD
B2 Vcc D2
DATA2
B3 Vss D3 SDDATA2
B4 SDCLK D4 SDDATA3/CD
Order code
Part Number
EMIF06-mSD01F2
Marking
HJ
TM: IPAD is a trademeark of STMicroelectronics
February 2007
Rev 1
1/7
www.st.com
7
1 page  
EMIF06-mSD01F2
3 Ordering information scheme
Ordering information scheme
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 2: Lead free Pitch = 500 µm, Bump = 315 µm
4 Package information
Figure 9.
Flip-Chip Package dimensions
500 µm ± 50
315 µm ± 50
650 µm ± 65
1.92 mm ± 50 µm
Figure 10. Foot print recommendations Figure 11. Marking
Copper pad Diameter:
250 µm recommended , 300 µm max
Solder stencil opening: 330 µm
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening recommendation:
340 µm min for 300 µm copper pad diameter
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet EMIF06-MSD01F2.PDF ] | |
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