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PDF IRGP4085DPBF Data sheet ( Hoja de datos )
| Número de pieza | IRGP4085DPBF | |
| Descripción | PDP TRENCH IGBT | |
| Fabricantes | International Rectifier | |
| Logotipo |  |
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PDP TRENCH IGBT
www.DaPtaDShe-et947U2.co8m6
IRGP4085DPbF
Features
l Advanced Trench IGBT Technology
l Optimized for Sustain and Energy Recovery
Circuits in PDP Applications
l Low VCE(on) and Energy per Pulse (EPULSETM)
for Improved Panel Efficiency
l High Repetitive Peak Current Capability
l Lead Free Package
Key Parameters
VCE min
VCE(ON) typ. @ IC = 70A
IRP max @ TC= 25°C c
TJ max
330
1.69
250
150
CC
V
V
A
°C
G
E
n-channel
E
C
G
TO-247AC
G
G a te
C
C o lle c to r
E
Em itter
Description
This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced
trench IGBT technology to achieve low VCE(on) and low EPULSETM rating per silicon area which improve panel
efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current
capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP
applications.
Absolute Maximum Ratings
Parameter
VGE
IC @ TC = 25°C
IC @ TC = 100°C
IRP @ TC = 25°C
PD @TC = 25°C
PD @TC = 100°C
Gate-to-Emitter Voltage
Continuous Collector Current, VGE @ 15V
Continuous Collector, VGE @ 15V
Repetitive Peak Current c
Power Dissipation
Power Dissipation
Linear Derating Factor
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature for 10 seconds
Mounting Torque, 6-32 or M3 Screw
Thermal Resistance
RθJC (IGBT)
RθJC (Diode)
RθCS
RθJA
Parameter
Thermal Resistance Junction-to-Case-(each IGBT) d
Thermal Resistance Junction-to-Case-(each Diode) d
Case-to-Sink (flat, greased surface)
Junction-to-Ambient (typical socket mount) d
Weight
Max.
±30
70
40
250
160
63
1.3
-40 to + 150
300
10lbxin (1.1Nxm)
Typ.
–––
1.6
0.24
–––
6.0 (0.21)
Max.
0.80
2.4
–––
40
–––
Units
V
A
W
W/°C
°C
N
Units
°C/W
g (oz)
www.irf.com
1
06/05/07
1 page  
10000
1000
Cies
IRGP4085DPbFwww.DataSheet4U.com
25
ID= 25A
20
15
VDS= 240V
VDS= 200V
VDS= 150V
100 Coes
Cres
10
5
10
0
100 200
VCE (V)
300
Fig 13. Typical Capacitance vs. Collector-to-Emitter Voltage
1
0
0 20 40 60 80 100 120
QG Total Gate Charge (nC)
Fig 14. Typical Gate Charge vs. Gate-to-Emitter Voltage
D = 0.50
0.1
0.01
0.20
0.10
0.05
0.02
0.01
τJ τJ
τ1 τ1
R1R1
CiC= iτi/τRi/iRi
R2R2
τ2 τ2
R3R3 Ri (°C/W) τi (sec)
τCτ 0.146 0.000131
τ3τ3 0.382 0.001707
0.271 0.014532
0.001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
1E-005
0.0001
0.001
0.01
t1 , Rectangular Pulse Duration (sec)
0.1
1
Fig 15. Maximum Effective Transient Thermal Impedance, Junction-to-Case (IGBT)
10
1 D = 0.50
0.20
0.10
0.1 0.05
0.02
0.01
0.01
τJ
τJ
τ1
τ1
R1R1
R2R2
τ2
τ2
R3R3
τ3
τ3
R4R4
τC
Ri (°C/W)
0.07854
τι (sec)
0.000637
τ 0.829201 0.000532
τ4
τ4 1.002895 0.003412
CiC=iτi/Ri/iRi
0.490875 0.055432
0.001
1E-006
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
0.001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 16. Maximum Effective Transient Thermal Impedance, Junction-to-Case (DIODE)
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