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PDF NCN6024 Data sheet ( Hoja de datos )
| Número de pieza | NCN6024 | |
| Descripción | Compact and Low Cost Smart Card Interface IC | |
| Fabricantes | ON Semiconductor | |
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NCN6024
www.DataSheet4U.com
Compact and Low Cost
Smart Card Interface IC
The NCN6024 is a compact and low cost single smart card interface
IC. It is dedicated for 3.0 V/5.0 V smart card reader/writer
applications.
The device is fully compatible with the ISO 7816−3 and EMV
standards as well as with standards specifying conditional access in
Set−Top−Box (STB).
Features
• Single IC Card Interface
• Fully Compatible with ISO 7816−3, EMV and Related Standards
Including STB Standards
• Three Protected Bidirectional Buffered I/O Lines (C4, C7 and C8
Card Pins)
• 3.0 V or 5.0 V ± 5% Regulated Card Power Supply such as ICC ≤
65 mA at VDDP = 4.5 V to 5.5 V
• Independent Power Supply on Controller Interface
(2.7 V < VDD < 5.5 V)
• Thermal and Short Circuit Protection on all Card Pins
• Support up to 20 MHz Clock with Internal Division Ratio 1/1, 1/2,
1/4 and 1/8 through CLKDIV1 and CLKDIV2
• ESD Protection on Card Pins up to 8 kV+ (Human Body Model)
• Activation/Deactivation Sequences
• Fault Protection Mechanisms Enabling Automatic Device
Deactivation in Case of Overload, Overheating, Card Take−off or
Power Supply Drop−out
• Interrupt Signal INT for Card Presence and Faults
• External Undervoltage Lockout Threshold Adjustment on VDD
(PORADJ Pin)
• Available in 2 Package Formats: SOIC−28 and TSSOP−28
• These are Pb−Free Devices
Typical Application
• Pay TV, Set Top Box Decoder with Conditional Access and
Pay−per−View
• Conditional Access Module (CAM)
• Portable Systems
• Point Of Sales and Transaction Terminals
• Electronic Payment and Identification
http://onsemi.com
MARKING
DIAGRAMS
28
NCN6024
AWLYYWWG
SOIC−28*
CASE 751F
1
*Consult Sales Office
TSSOP−28
CASE 948AA
NCN
6024G
ALYW
NCN6024 = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 13 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
July, 2009 − Rev. 1
1
Publication Order Number:
NCN6024/D
1 page  
NCN6024
ATTRIBUTES
Characteristics
ESD protection
Human Body Model (HBM) (Note 1)
Card Pins (Card Interface Pins 9 − 17)
All Other Pins
Machine Model (MM)
Card Pins (Card Interface Pins 9 − 17)
All Other Pins
Moisture sensitivity (Note 2) SOIC−28 and TSSOP−28
Flammability Rating Oxygen
Index: 28 to 34
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test
1. Human Body Model (HBM), R = 1500 W, C = 100 pF.
2. For additional information, see Application Note AND8003/D.
Values
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8 kV
2 kV
400 V
150 V
Level 1
UL 94 V−0 @ 0.125 in
MAXIMUM RATINGS (Note 3)
Rating
Symbol
Value
Unit
DC/DC Converter Power Supply Voltage
Power Supply from Microcontroller Side
External Card Power Supply
Charge Pump Output
Digital Input Pins
Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT)
Smart Card Output Pins
Thermal Resistance Junction−to−Air
SOIC−28
TSSOP−28
VDDP
VDD
CRD_VCC
VUP
Vin
Vout
Vout
RqJA
−0.3 v VDDP v 5.5
−0.3 v VDD v 5.5
−0.3 v CRD_VCC v 5.5
−0.3 v VUP v 5.5
−0.3 v Vin v VDD
−0.3 v Vout v VDD
−0.3 v Vout v CRD_VCC
75
76
V
V
V
V
V
V
°C/W
Operating Ambient Temperature Range
TA
−40 to +85
°C
Operating Junction Temperature Range
TJ
−40 to +125
°C
Maximum Junction Temperature
TJmax
+125
°C
Storage Temperature Range
Tstg
−65 to + 150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C
http://onsemi.com
5
5 Page 
NCN6024
The internal activation sequence activates the different
channels according to a specific hardware built-it sequencing
internally defined but at the end the actual activation
sequencing is the responsibility of the application software
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and can be redefined by the micro-controller to comply with
the different standards and the different ways the standards
manage this activation (for example light differences exist
between the EMV and the ISO7816 standards).
Figure 4. Activation Sequence − RSTIN mode (RSTIN Starting High)
Figure 5. Activation Sequence − Normal Mode
http://onsemi.com
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| PDF Descargar | [ Datasheet NCN6024.PDF ] | |
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